Electronics Forum | Mon Mar 07 21:37:42 EST 2005 | ABHI
It depends on your product requirements. I have seen aluminium wire bonding operations in as high as class 100K clean rooms. These are the assembly areas for calculators. The best is class 10K clean room for wire bonding. You can go upto fine pitch w
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
Electronics Forum | Tue May 24 17:07:36 EDT 2005 | davef
Eric: For the amount of dross that you're removing, we're concerned that you could be loosing the balance of your solder alloy, because dross consists primarily of tin oxides. It has little lead in it, beyond than the lead content of the solder that
Electronics Forum | Thu Jun 02 04:41:27 EDT 2005 | PW
K, aim to prevent return of rejected components back into stores. Consider potential damage caused through handling post pick and the effect of your product quality in using these components in the future. The best place to address this problem is a
Electronics Forum | Fri Sep 09 07:55:08 EDT 2005 | davef
This pattern indicates flex cracking due to excessive bending of the board or fixture after soldering. Ceramic is strong in compression, but weak in tension. When bending causes damaged parts, look at: * Board flexes, ceramic is strong in compressio
Electronics Forum | Mon Oct 03 22:12:53 EDT 2005 | davef
When we see warp and twist, we usually jump the fabricator for: * MLB construction (not homogeneous or unbalanced - too resin rich or poor) * Supplier process capabilities (lamination cycles) * Material selection (usually cheap and dirty), etc. War
Electronics Forum | Fri Nov 18 07:14:53 EST 2005 | avalancher
It's easier if the Operator does keep an eye over that, HOWEVER, if you really think about it, you are allowing the very person who ran the board monitor the quality of the board (again, re-visiting AOI errors, and what they allow and don't allow). A
Electronics Forum | Wed May 10 08:41:19 EDT 2006 | russ
Yes, we added some soak, we also use a 5 zone oven. We utilize a .020" x .020" pad with center to center at .042". We only get tombstones on misplacement or bad paste release now. Registration of component is key with pbfree, the parts just don't s
Electronics Forum | Fri May 26 16:24:45 EDT 2006 | Jak
Due to spacing issue, we are considering using power bricks with tin/lead solder ball instead of PTH package. The solder ball is 40 mil diameter. Our CM suggested they do hand place since the pick and place nozzle cannot pick up and hold the part due
Electronics Forum | Tue Sep 05 14:22:25 EDT 2006 | Cmiller
The YesTech machine is an exceptional machine for the price. You may be able to find other machines with similar performance, maybe even at similar cost but if you are having no issues with them why go through the cost of putting in a new software pl
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