Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Thu Feb 20 17:18:24 EST 2003 | davef
Give us infortmation, please. What is [are]: * Height board to board side of the interposer on the low side of uBGA * Height board to board side of the interposer on the high side of uBGA * Alloy of solder balls, no paste was used correct? * Type of
Electronics Forum | Fri Mar 21 08:56:29 EST 2003 | russ
Is it possible that the flux you used, if applied in excess could have caused the balls to "blow out". I have seen this in the past and it was related to the type of flux we were using and the amount. Russ
Electronics Forum | Mon Mar 24 08:57:20 EST 2003 | russ
I don't know if I would call it a "blow hole". what I believe happens (I don't have a camera to watch spheres during the reflow process) is that when the flux starts heating up, expansion, bubbling, or something physically displaces the balls. We fo
Electronics Forum | Tue Jun 25 09:55:25 EDT 2013 | bandjwet
We are looking for a recommendation for a company that can perform solder ball inspection on BGAs. The devices are in trays and the the challenge is the ultra fine pitch (0.4mm) and ball size (0.25mm diam). We are looking for ball diameter and coplan
Electronics Forum | Fri Sep 17 23:19:07 EDT 2004 | KEN
What is the component ball co-planarity spec? I have encountered many ceramic and ASIC devices that specify 7 mil max. If your stencil is 4, 5, 6 mil you WILL eventually have an open joint. You must deposit solder greater than or equal to your cop
Electronics Forum | Wed Jan 23 01:24:45 EST 2008 | dragonslong
Hi ppl, i just joined my company as a quality engineer and was revising our incoming visual inspection. I was reading the IPC guidelines of IPC-7095. However, i have some problems which i hope the experts from this forum could help. IPC-7095: At on
Electronics Forum | Tue Aug 13 09:31:48 EDT 2002 | ksfacinelli
I am looking at placing a Altera BGA device that has a .45mm Nominal Ball Dia. with a .8 spacing c-c between balls. The PCB will be gold plated so co-planarity should not be an issue. Interested in suggestions that may assist producability when pla
Electronics Forum | Tue Nov 02 09:05:15 EST 2004 | russ
I have never experienced voids when using the flux only for application. Search the archives for void causes. As far as "more paste is better" I think that could be a true statement if we are talking about adapting to co-planarity type issues. My
Electronics Forum | Fri Oct 25 12:23:49 EDT 2002 | yngwie
Hi Experts, I'm facing short problem with BGA at SRT rework in one particular BGA. It is BGA, with a metal piece at the center like a coin. The BGA is located in between two high profile press fit connectors and the short always observed at the si
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