Electronics Forum | Sat Aug 29 09:12:39 EDT 1998 | Dave F
| Hi folks, | Lately I am also having problem with BGA ball problem. | We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could | rework on CCGA but there is no certified process in industry as w
Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289
This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i
Electronics Forum | Tue Feb 09 13:47:46 EST 2010 | davef
BGA rework equipment: Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=48736 Use x-ray inspection to identify the obvious defects such as shorts, missing balls and gross solder voids.
Electronics Forum | Thu Jan 12 15:43:57 EST 2006 | amol_kane
Hi all, while looking at some XRF equipment, a question arose as to the need for testing lead-free components at the CEM facility.....if a CEM has RoHS compliancy certificates from component vendors, is that "Due diligent enough" to absolve the CEM o
Electronics Forum | Mon Jul 15 09:41:11 EDT 2002 | soupatech
I am experimenting with 2 types, FG256 17x17mm and FG456 23x23mm both with a 1mm pitch and .5mm ball. They both have a full array. As for as the x-ray, we are looking into pruchasing some used equipment but will mostly send them out for testing until
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon
| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Fri Feb 12 11:45:14 EST 2010 | ppcbs
Greetings, > > We are looking to purchase > equipment to rework / repair our circuit boards > with BGAs. Our newer boards are starting to have > more and more BGAs. > > Is there any information > that "ranks" BGA rework stations? - a kind of a
