Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Mon Jun 21 01:32:20 EDT 2021 | yaxindatech
We can reproduce a prototype for you, if the defect can not be repaired. We are a PCB manufacturer in shenzhen China. It can be manufactured as a sample order in 2-3 working days.
Electronics Forum | Wed Aug 01 18:42:23 EDT 2018 | deanm
How close are your SMT pads to the gold fingers? Can you supply a photo?
Electronics Forum | Wed Aug 01 08:58:02 EDT 2018 | 2219576
Please check the solder paste height near PCB edges, Please check board clamping during solder paste printing. Please check tooling support boards must be fixed during the printing process. try to set wiper cleaning frequency and fine tune for best
Electronics Forum | Tue Aug 14 08:09:32 EDT 2018 | buckcho
Try something drastic just for testing - turn off cleaning! Then check again the result. Trust me, you can be surprised.
Electronics Forum | Tue Aug 14 09:39:31 EDT 2018 | stephendo
Every place I have ever worked has taped off the gold fingers. Maybe not the first run but within a few runs.
Electronics Forum | Fri Jul 27 13:51:53 EDT 2018 | vlad_saviuk
Hi, have some question: during solder paste printing I'm faced with problems on the edge of the PCB - solder balls on gold pads. During analisys we checked everything - change squeegee preasure, different cleaning cycles, squeegee speed - no effect.
Electronics Forum | Tue Aug 14 13:54:57 EDT 2018 | etmpalletguy
Vlad, Reduce your aperture opening in the stencil, this will give the stencil a good seal around the specific area of concern. In a wave solder environment, solder balling top or bottom surfaces in a wave pallet is caused by excessive flux burning o
Electronics Forum | Sat Jul 28 15:59:18 EDT 2018 | davef
Search the SMTnet Archives for threads like: * http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=14504&#Message60895 * http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=5127 * http://www.smtnet.com/forums/In
Electronics Forum | Tue Mar 19 09:29:08 EST 2002 | Basaran
What type of solder ball defect that you want to avoid is it voids or misregistration or ball-pad adhesion. Cemal Basaran
