Electronics Forum | Mon Oct 19 07:39:15 EDT 2009 | m_imtiaz
Hi, We are facing solder ball problem in manual soldering process (between wire and terminal). we are using no-clean solder (63:37)and temperature setting in iron is around 400 Cel. Can any one suggest me how to solve this problem Any thoughts would
Electronics Forum | Mon Oct 19 15:08:14 EDT 2009 | markhoch
Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues b
Electronics Forum | Thu Mar 24 16:53:53 EDT 2011 | davef
Can you jumper the via to the pad?
Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar
I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not
Electronics Forum | Thu Mar 24 15:58:52 EDT 2011 | davef
Just build-up the boards and ship them. Be sure to inform your customer about the problem that you have with their design and ask that the via be filled and plated over to prevent the problem in the production runs.
Electronics Forum | Thu Mar 24 18:05:54 EDT 2011 | nkinar
That's really interesting, davef. How would I jumper the via to the pad? Could you elaborate?
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
Electronics Forum | Thu Apr 17 16:41:37 EDT 2003 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09%
Electronics Forum | Wed Nov 21 21:50:50 EST 2001 | Glenn Robertson
Tony, What you are seeing can occasionally be caused by gaps in the plating of the blind vias. If they are not "airtight" you can get moisture coming from the laminate that shows up as voids in the solder balls. You might check on the board sup
Electronics Forum | Tue Nov 20 20:58:43 EST 2001 | davef
Very coo!!! [You have done an outstanding job of describing your situation.] I guess the via are connected to a BIG chunk of copper that affects your profile on that pad / ball. At the same time, run a profile each on a: * Void pad * Nonvoid pad
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