Electronics Forum | Fri Jul 30 03:33:07 EDT 2004 | tuner73
Is anyone out there reworking the AMP BGA ziff sockets? AMP's recommendation is that it cannot be reworked. I have successfully reworked the 604 ball version of this socket, but I am having problems with the 603 ball version. I am using an Air-Vac
Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco
Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching
Electronics Forum | Mon Oct 19 07:39:15 EDT 2009 | m_imtiaz
Hi, We are facing solder ball problem in manual soldering process (between wire and terminal). we are using no-clean solder (63:37)and temperature setting in iron is around 400 Cel. Can any one suggest me how to solve this problem Any thoughts would
Electronics Forum | Mon Oct 19 15:08:14 EDT 2009 | markhoch
Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues b
Electronics Forum | Thu Mar 24 16:53:53 EDT 2011 | davef
Can you jumper the via to the pad?
Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar
I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not
Electronics Forum | Thu Mar 24 15:58:52 EDT 2011 | davef
Just build-up the boards and ship them. Be sure to inform your customer about the problem that you have with their design and ask that the via be filled and plated over to prevent the problem in the production runs.
Electronics Forum | Thu Mar 24 18:05:54 EDT 2011 | nkinar
That's really interesting, davef. How would I jumper the via to the pad? Could you elaborate?
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
Electronics Forum | Tue Aug 24 17:59:10 EDT 2010 | davef
A board support must be used to prevent bowing of the board during insertion of the sockets. It should have a flat surface with holes or a channel large enough to receive the sockets during installation. [Tyco AUGAT HOLTITE Socket Application Note 11
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