Electronics Forum | Mon Dec 29 16:49:57 EST 2014 | emanuel
Hi Rob, I am writing this reply as an update. Unfortunately I got your recommendation a bit too late, I contacted Count-On Tools and ordered from them a custom made nozzle for the Emerald. $300 paid for the "pleasure", everything could be OK if it w
Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
Electronics Forum | Thu Apr 14 15:33:41 EDT 2022 | ppcbs
I've never lost memory in a BGA from heat removal. However we can create a profile on our BGA rework stations to remove using bottom heat only. This exposes the BGA body to temperatures of around 190 to 200C. I have a colleague that has a machine
Electronics Forum | Sat Jan 15 03:30:25 EST 2000 | Dean
I have reduced solder balling by up to 60 percent by changing the placement height on chip parts. Essentially account for the 6 mills of "Z" height to reduce the "squeezing" effects of the chip impacting the solder bricks. Cheap and easy, especial
Electronics Forum | Fri Aug 05 18:10:11 EDT 2011 | davef
* Attaching thermocouple to CSP or BGA is a challenging task. Usually a hole is drilled at the center and the thermocouple is routed through the bottom of the board and to the area of interest. In particular, since the CSP stand off is very small, a
Electronics Forum | Mon Feb 25 07:59:47 EST 2002 | Jim Mills
Customer has requested a custom CBGA pakaged resistor network.I've seen a lot of info about TCE mismatch but aslo have heard that using 0.025-0.030 balls offers some stress releif which allows for the TCE mismatch to become less of a problem. Would
Electronics Forum | Wed Dec 05 18:28:54 EST 2012 | cnotebaert
what type of part is this a micro BGA by chance? there is a mill spec (man I cant remember it right now), I'll get back to you! it provides acceptance criteria for chip/crack/gouges.... if it doesn’t expose the lead frame (inner workings of the devic
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Mon Mar 30 16:39:04 EST 1998 | Tony Arteaga
Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same compon
.png)
