Electronics Forum: ball soline co 20 (Page 1 of 2)

XBOX 360, BGA ball problem?

Electronics Forum | Thu Oct 25 20:15:23 EDT 2007 | wayne_

should have provide the link for all of you to look at it.... http://techon.nikkeibp.co.jp/article/HONSHI/20070926/139719/ to look at the real case study......:)

Solder balls

Electronics Forum | Mon Jul 28 06:13:35 EDT 2008 | cobar

Your problem is being caused by to much paste being printed.Reduce apeture size on stencil. http://www.shanelo.co.za/technical_paper_about_stencil_de.htm or http://www.shanelo.co.za/SMD%20Assist.htm

Solder Balls-No Clean Paste/ Article on Stencil Design Guideline

Electronics Forum | Fri Aug 20 10:49:37 EDT 2010 | cobar

Article to assist with Stencil Design Guidelines http://shanelo.co.za/technical_paper_about_stencil.htm

Re: Solder FINES vs. Solder Balls

Electronics Forum | Wed Apr 14 17:39:20 EDT 1999 | Dave F

| Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | I consider "fines" individual unmelted metal spheres that are found in s

Re: Solder FINES vs. Solder Balls

Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea

| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun

SRT 1000, WHAT ELSE?

Electronics Forum | Wed Mar 10 20:13:23 EST 1999 | Earl Moon

For Dean and the rest of you interested, I have reconciled many of my thermal issues with this machine and its peculiarities. The bottom side heater seems adequate, at 750 watts (not going to spend 10 grand extra for 500 more watts no matter what) a

Solder wetting to ENIG pads

Electronics Forum | Tue May 13 08:26:29 EDT 2008 | davef

First, on your reflow temperature comment: The 183*C focus for reflow recipes for tin-lead solder is a falicy. If you held a recipe for tin-lead solder at 183*C peak, it would never reflow. Recipes for tin-lead solder need to be at liquidus plus 20*C

Re: Solder FINES vs. Solder Balls

Electronics Forum | Thu Apr 15 15:07:20 EDT 1999 | Mark Charlton

| | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | I consider "fines" individual unmelted metal spheres that ar

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W

| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau

| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph

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