Electronics Forum | Tue Dec 31 10:06:37 EST 2019 | emeto
This one is easy. Go to 5mil stencil and reduce apertures in width. try to have 10mil aperture width and 10 mil distance in between. If you give us numbers we will be more precise.
Electronics Forum | Mon Jun 21 01:32:20 EDT 2021 | yaxindatech
We can reproduce a prototype for you, if the defect can not be repaired. We are a PCB manufacturer in shenzhen China. It can be manufactured as a sample order in 2-3 working days.
Electronics Forum | Fri Jan 31 00:21:28 EST 2020 | jineshjpr
Thanks for your response, attaching the solder profile for your verification. The part NXP Make PCA2002 Micro BGA 8Ball Package.
Electronics Forum | Fri Mar 06 22:12:56 EST 2020 | portersmt
Is there any recommendation you'd have when adding grease - how many pumps into the grease adapters would you do? Should you visually see the grease coating the entire ball screw / LM rail?
Electronics Forum | Mon Mar 23 16:38:09 EDT 2020 | emeto
Steve, On 16mil pitch I would try 12mil diameter on 5mil stencil, unless the BGA ball size is something unexpectedly huge.
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
Electronics Forum | Thu Apr 30 23:21:52 EDT 2020 | SMTA-Davandran
I am seeing a lot of solder ball for PIP process. is it due to the paste height go beyond 0.2mm.? what is the DOE need to focused for PIP process?
Electronics Forum | Thu Apr 30 23:28:17 EDT 2020 | SMTA-Davandran
Do considering AR and 5 balls rule during designing stencil aperture. it give better paste release. Aperture redesigning need to look into symptom that we are seeing on AOI. It will be given us idea hows to improve aperture design to improve SMT firs
Electronics Forum | Tue Jun 23 13:23:55 EDT 2020 | emeto
If you swear in having consistent print, I bet you it is the part. Some of these BGAs probably have missing or inconsistent balls.
Electronics Forum | Mon Jul 06 16:54:51 EDT 2020 | emeto
For repair - passive components you can solder with corresponding chemistry. You remove the old part, clean the pad surface. Now you can match component and solder as needed. BGA is more difficult as they already balled the part with certain chemistr
