Electronics Forum | Tue Oct 24 22:36:29 EDT 2000 | DL
On the main page of Smtnet towards the end of the opening paragraph states the following...Your " research continues in determining the reliability of thick film hybrid microcircuits and similar technologies using low-temperature, co-fired ceramics.
Electronics Forum | Thu Jul 20 14:31:20 EDT 2000 | Bob Willis
The process is not that difficult so have a go as soon as possible. Take a board wipe some paste on a board stick the part in and run it through the reflow process. Don�t worry about balling just see what you get first, that what I did first ! The m
Electronics Forum | Tue May 22 00:01:43 EDT 2001 | philipreyes
Hi to all!! For those who have current process of Placing BGA package (SMT using BGA package), do you have any idea what is the acceptable misalignment of the balls on the pads of PCB? I have here with me the IPC 7095 BGA Assembly and Design but
Electronics Forum | Sun Jun 10 11:08:26 EDT 2001 | nifhail
I know that there is no pre-defined strength for the solder joint as it will depend on solder volume deposited, pad geometry, lead component's lead solderability etc. but, what would be the best ball park for the good joint for 0402, 0603, 20 mil pti
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Mon Jun 18 19:22:38 EDT 2001 | Gil Zweig
Dave; See my answer to "Alternate to X-ray" The combination of endoscope optical inspection with x-ray inspection provides the most effective means of BGA inspection. Transmission x-ray provides a very rapid means of qualifying then process control o
Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
Electronics Forum | Sun Jun 24 05:03:20 EDT 2001 | ronih
Hello, I need some information about footprint of BGA / fine BGA. As far as I know the pad on PCB should be the same as the pad on the BGA (much smaller than the ball dia.). I need some information regarding the hole SMT process: - Paste printing:
Electronics Forum | Fri Aug 10 19:49:32 EDT 2001 | nifhail
What would be the best method for attaching the balls, when doing BGA rework. I Found that by using the solder paste, it will give us better rework yield vs using the paste flux ? My data was collected from a very small experiment and hard to conclud
Electronics Forum | Tue Jul 24 09:15:47 EDT 2001 | gdstanton
Folks, Does anyone have data to support that a minimum clearance left around the perimeter of a BGA on a board design can improve its solderability? In other words, if X distance is left open (free of components) around the BGA, could ball solderab
