Electronics Forum | Wed Dec 23 11:11:07 EST 1998 | john watt
| | I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it d
Electronics Forum | Fri Dec 18 00:48:35 EST 1998 | Mr Mariscal
I have developing a BGA Process and having problems with 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the stange thing is that it does not happ
Electronics Forum | Wed Dec 09 07:48:23 EST 1998 | EFData
Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?)
Electronics Forum | Tue Jul 28 02:28:48 EDT 1998 | Bob Willis
The causes for solder on gold are: Paste wash offs Dirty stencils Dirty under stencil cleaning cloths/no solvent Poor handling The most common reason is wash offs when there is a couple of balls left on the tabs and they reflow. With correct profile
Electronics Forum | Fri Jul 10 13:49:27 EDT 1998 | Bob Willis
I have some nice simple test methods that I will email to you this weekend thats one of the documents I must put on my site. | I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a
Electronics Forum | Fri Jul 10 13:48:41 EDT 1998 | Bob Willis
I have some nice simple test methods that I will email to you this weekend thats one of the documents I must put on my site. | I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a
Electronics Forum | Thu Jun 18 09:26:38 EDT 1998 | Maurice McClain
WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATURE S
Electronics Forum | Sun May 31 16:07:25 EDT 1998 | Alain De Bock
Is there anyone who knows what the influence is of the dip-fluxing process on the placement accuracy of a flip-chip. If you perform dip-fluxing after component alignment, the component may be displaced on the nozzle; if you perform component alignmen
Electronics Forum | Sun May 24 08:38:53 EDT 1998 | Dave F
| I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | Earl Moon Earl: We send the BGAs to a service "re-baller." Dave F PSI, 16833 FM 1431 #E
Electronics Forum | Mon Aug 27 22:48:21 EDT 2001 | dougk
Used an older model of the one you described. Have used Asymtech and Fuji's as well. The Camalot is accurate, reliable, and easy to program. The only things I disliked about it was that is was slower than the fuji's, and if the pressures weren't set
