Electronics Forum | Thu Feb 08 12:02:15 EST 2001 | slthomas
After reading the variety of responses, I feel moved to ask if you're you talking about what are occasionally referred to as solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) or the solder balls that ten
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Wed Jun 30 10:24:27 EDT 2004 | K
We find keeping the work environment at about 22degC and humidity to about 40-50% is the best way to control the solder balls. Before we took measures we were out of control with solder balls especially in the summer months. We run aqueous solder thr
Electronics Forum | Thu Feb 08 12:16:05 EST 2001 | Antonio
I wasn't specific which type. But all this info helps. Thanks a bunch fellas...
Electronics Forum | Tue Jun 12 18:08:44 EDT 2001 | davef
I'd say that this is close enough to call a meeting of your Material Review Board and hash this out.
Electronics Forum | Mon May 10 18:43:23 EDT 2004 | steve davis
Just curious what stencil company are you currently using? What style of aperture are you using for the componet?
Electronics Forum | Thu Jun 24 07:55:08 EDT 2004 | cyber_wolf
What manufacturer of solder paste are you using? Just curious.
Electronics Forum | Sat Jul 03 02:15:05 EDT 2004 | yukim
So did you change the solder paste? And did it work? What solder paste is it?
Electronics Forum | Sat Jul 03 02:16:56 EDT 2004 | yukim
What's the difference between static and dynamic viscosities? Is there any relationship between Brookfield and Malcom Viscosity Values?
Electronics Forum | Thu Jul 22 16:06:07 EDT 2004 | russ
What is your pad dimensions/spacing at components you are having trouble with
