Electronics Forum: barcodes copper wire (Page 2 of 12)

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Thu Nov 03 04:31:21 EST 2005 | arnold

davef, how can you convince me that 100Sn dissolved copper much faster?

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol

the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation

how to solder manganin 0.05mm manganin wire to a copper plate

Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser

Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Wed Nov 02 22:06:54 EST 2005 | davef

Slaine, our intuition is the same as yours [that 100Sn should dissolve the copper faster than other solders]. Bob Gilbert's FCT data shows otherwise. Look here: http://www.fctassembly.com/newsltr/2004/0804/Aug04.htm

how to solder manganin 0.05mm manganin wire to a copper plate

Electronics Forum | Thu Jan 29 09:18:36 EST 2015 | davef

Nichrome, manganin, phosphor bronze etc are easy to solder ... the hard part is removing the corrosion * Manganin: 86% copper, 12% manganese, 2% nickel. Often, it's used in making cryogenic measurements, due to its low heat loss. * Select a flux for

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly

Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte

wire harness strength

Electronics Forum | Thu May 18 03:15:32 EDT 2017 | wama

We are soldering wire 26AWG to jack socket. However after went through washing, baking, coating, curing processes the wire breaks (at joining point with jack socket) during wire dressing. We have tried to increase and decrease the solder amount but r

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack

Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal

Criteria for thermocouple wire attachment

Electronics Forum | Wed Dec 20 23:29:32 EST 2006 | Jack

Hi all, Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true? (1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components can be cons

Plating for aluminum wire bonding

Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini

Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards


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