Electronics Forum | Thu Jan 23 08:08:10 EST 2014 | charliedci
Should stranded copper wire (20 gauge 19 strand) be tinned prior to insertion into screw connector? One of our customers "suggests" tinned, but past experience tells us no.
Electronics Forum | Thu Jan 23 08:18:07 EST 2014 | aflex
Even for me its a No. Its quiet strange why some preferred tinned ones.
Electronics Forum | Wed Nov 02 01:24:07 EST 2005 | arnold
we are encountering a problem on our production. after dipping a copper wire AWG#30 to a leadfree solder the wire becom thinner and easily to break. does the leadfree soler has the capability to weaken the wire (lessen the diameter)after dipping to l
Electronics Forum | Thu Jan 29 05:13:35 EST 2015 | neeraj_iiser
how to solder manganin 0.05mm manganin wire to a copper plate
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Thu Nov 03 07:22:16 EST 2005 | davef
arnold: I did not say that Sn100 dissolved copper faster. The graph of dissolution rates [from the link above] shows that Sn100 dissolves copper slower than many of the other solders.
Electronics Forum | Wed Nov 02 21:58:17 EST 2005 | KEN
Copper wire will become thinner when dipped in tin/lead or lead free solder. The copper is disolved off of the bulk wire. This is one reason rework on solder pots must be restricted. Eventually, after repeated cycles you will have smaller and sma
Electronics Forum | Wed Nov 02 03:35:09 EST 2005 | Slaine
I thought it was the tin content that leached the copper so presumed 100Sn would be more aggressive?
Electronics Forum | Thu Nov 03 04:31:21 EST 2005 | arnold
davef, how can you convince me that 100Sn dissolved copper much faster?
Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol
the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation
