Electronics Forum: bare die tray (Page 1 of 5)

Soldering die to heatsinks

Electronics Forum | Thu Apr 16 08:07:05 EDT 1998 | Stan

Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare die.

Re: Soldering die to heatsinks

Electronics Forum | Fri Apr 17 14:08:44 EDT 1998 | Earl Moon

| Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else | have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare

Do yo have to bake unused bare boards or just Vacuum Pack?

Electronics Forum | Sun Aug 27 20:30:53 EDT 2006 | darby

AJ, We use all ENIG boards. After opening, any remaining boards are kept in low humidity keeping cabinet. I have never experienced a problem using this method I think the longest I have kept them this way is eighteen months. We also store any open tr

Hover-Davis DDF, what are your opinions?

Electronics Forum | Tue Jan 23 10:57:54 EST 2001 | mdaley

Hello, I'm currently in the process of determining the best way to place bare die (flip chip) on our substrates. I've seen the Hover-Davis DDF and was impressed by it's capabilities. I particularly like the fact that I won't incur the cost of packa

COB Process (Chip On Board)

Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI

Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject

Die Crack Monitoring (DCM)

Electronics Forum | Mon Sep 19 09:25:29 EDT 2011 | tech1

There are a few questions I have before we can answer this: 1. How are the die presented to the pick and place machine? (Tape, waffle Pak, tray) 2. What are the dimensions of the die (LxWxH)? 3. Are they bumped die? 4. What is the material of the

Adhesive Dispense Equipment

Electronics Forum | Mon Oct 29 15:18:31 EST 2001 | Chris

I am attaching bare die using conductive epoxy. Thanks, Chris

Viking Wafer Map Format

Electronics Forum | Sat Nov 14 14:22:25 EST 2020 | davef

Steve wants to place bare die with the Zeva CT2000. Is anyone doing that?

DCA/Wire Bonding/Encapsulation

Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David

Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?

Where can i find Chip-on-board Forum?

Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest

Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te

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