Electronics Forum | Mon Nov 14 10:45:05 EST 2005 | kmeline
We seem to be having a lot of issues with solder not flowing to the end of surface pads especially on fine pitch. These are assemblies we have run in the past with few issues. The bareboard finishes do not look the best. Has anyone been experiencing
Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan
Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa
Electronics Forum | Mon Nov 14 12:23:56 EST 2005 | russ
What is the finish of the PCB? What type of paste are you using?
Electronics Forum | Mon Jun 12 17:03:21 EDT 2006 | pjc
Its in the IPC 600 bare-board specification.
Electronics Forum | Thu Feb 10 04:37:29 EST 2000 | Wolfgang Busko
Russ: If it�s true that they have been reworked to HASL I guess that something went awefully wrong at that stage. If you have some bareboards left have them checked thoroughly. M2C Wolfgang
Electronics Forum | Mon Nov 14 14:59:32 EST 2005 | davef
Additional questions are: * Does the problem appear with pasted/soldered only boards, in addition to those with components? * What is the size of the unsoldered area? What is the size of the pad? * Where is the solder mask, relative to the pad? * Wha
Electronics Forum | Wed Aug 29 10:16:19 EDT 2007 | ed_faranda
Looking for a single sided tape so that I can apply to a bareboard for test screen printing. Anyone have any suggestions?
Electronics Forum | Tue Oct 28 12:02:11 EDT 2008 | milas
Hi We have recently specified the following on a bareboard that has an ENIG finish. Does it sound about right or is it likely to give me problems ? Nickel : 3uM � 7uM Gold : 0.05 uM � 0.1 uM Thanks in advance
Electronics Forum | Thu Jan 15 10:08:54 EST 2004 | ADAM
Guys Does anyone have any design rules for a 121 pin BGA . The pitch is 0.031 thou, the ball diameter is 0.0115 thou . I would like to know the following : Pad and via sizes/type on the bareboard ? Stencil thickness and aperture size/sytle ? Solder
Electronics Forum | Wed Sep 01 05:29:40 EDT 2010 | arjan
We baked the parts just before assembly. 2>we baked the parts and store them in 4 days in drycab (60degC, Rh0,5%)and finally assembly 3> we baked the parts and refowed them on a leadfree profile and finally the assembly on the boards. The same we als
