Electronics Forum | Fri Oct 15 11:03:50 EDT 2010 | hegemon
Well, we got the baking part right at least. I would think that would help to rule out the barrel cracks allowing moisture escape. Plating too thin makes sense to me. In any case, do you think barrel cracking would be observable on a bare PCB?
Electronics Forum | Thu Jan 12 14:17:07 EST 2012 | blnorman
How are the vias failing? Barrel crack?
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Fri Oct 15 08:01:12 EDT 2010 | patrickbruneel
What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick
Electronics Forum | Fri Oct 15 08:00:09 EDT 2010 | patrickbruneel
What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
Electronics Forum | Thu Jul 26 22:52:47 EDT 2001 | davef
GT 8 years ago every board saw "touchup". Touch was done to fix boards to conform to A-610. Now A-610 allows less than complete hole fill. Our operators were totally freaking nuts about touching boards. They touched each others touch and on and o
Electronics Forum | Tue Oct 27 06:29:49 EDT 2009 | lococost
Yes it is possible, and yes you shouldn't trust boards that have this problem. You're best off baking PCB's this old befor reflow. This looks like barrel cracking, a quick google gives: http://www.eco3.co.uk/e3toolkit/e3toolkit/modules/05/05_04_j_pc
Electronics Forum | Fri Oct 15 11:32:04 EDT 2010 | patrickbruneel
Inspecting for plating problems shouldn’t be part of incoming inspection. Your board manufacturer should have the appropriate process control. I shouldn’t have said barrel cracks but plating skips. Plating skips are caused by dull drills or a too hi
Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
