Electronics Forum | Thu Apr 18 16:52:15 EDT 2002 | davef
General comments are: * First place I would look is the supplier of the pins that you are trying to install. Most suppliers that sell press fit components have done a good deal of work to qualify the component and will have all the specifications yo
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Mon Feb 15 17:57:01 EST 1999 | Earl Moon
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Fri Oct 15 08:01:12 EDT 2010 | patrickbruneel
What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick
Electronics Forum | Fri Oct 15 11:03:50 EDT 2010 | hegemon
Well, we got the baking part right at least. I would think that would help to rule out the barrel cracks allowing moisture escape. Plating too thin makes sense to me. In any case, do you think barrel cracking would be observable on a bare PCB?
Electronics Forum | Fri Oct 30 01:07:34 EST 1998 | Earl Moon
| I am a recently graduated Process Engineer. I am working for a company developing and manufacturing printed circuit boards. I am looking for a web link, magazine article, book, etc which describes the processes which happen at a board house. More s
Electronics Forum | Thu Jan 12 14:17:07 EST 2012 | blnorman
How are the vias failing? Barrel crack?
Electronics Forum | Fri Oct 15 08:00:09 EDT 2010 | patrickbruneel
What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick
Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
