Electronics Forum | Wed Aug 21 17:03:13 EDT 2013 | hegemon
I think your pre-heat temp is a little low for SAC 305 Soldering. Especially with a Pallet. You might want to try to add some time and temp to get the PWB itself preheated up to 150-160C. That should help with the barrel fill. Make sure your board
Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Wed Dec 19 09:41:14 EST 2012 | dyoungquist
What is your solder pot temperature? We found that on a 0.093" multilayer board increasing the temp of the lead free solder from 300C to 315C helped with the barrel fill.
Electronics Forum | Tue Dec 18 10:14:14 EST 2012 | moshesh
In those cases where we have a 3.2mm thick, 16-layer board with several GND layers, do we still need ground connection to each and every layer (with thermal relief) or, skip part of the ground patterns? Will it help soldeing rising. I can't reach mor
Electronics Forum | Wed Apr 13 21:17:18 EDT 2022 | stephendo
If it was ROHS, I would say that the pads are definitely dissolved away. And it sounds like that is the case here. Your best bet is if it is class 2 and the barrels are at least 50% then push for them to be accepted. If you are trying for more barr
Electronics Forum | Wed Apr 13 12:10:47 EDT 2022 | winston_one
Hello! We have a strange effect. Some pads of big trough-hole DDR slot just dessapear. Initialy it was soldered with selective soldering process (leaded, 290 degrees, ImSn finish, very short storage). Then some connectors with poor barrel fill we hav
Electronics Forum | Thu Apr 14 13:49:34 EDT 2022 | winston_one
Thank you for reply, Stephen. No, As I wrote it was leaded process. I heard that it is possible with lead free solder at higher temps an dwell time. At NPL Defect Database I've find this case wich looks exactly the same: http://defectsdatabase.npl.co
Electronics Forum | Thu Nov 03 09:43:55 EST 2005 | lupo
Check flux penetration and type of flux. How much is solid contents. The solder filling is better under Nitrogen. Check the time (speed) of the nozzle whether is correct. Usually For SAC305 the temperature of bath is 320C/degrees, but only for sel
Electronics Forum | Thu Jun 29 12:07:09 EDT 2017 | georgetruitt
HOW THICK IS THE BOARD? IS THERE A LOT OF COPPER IN THE BOARD? DOES YOUR CUSTOMERS PROVIDE HEAT RELIEF IN THE BOARDS BARREL DESIGN THERE NEEDS TO BE PLENTY OF ROOM FOR LEADFREE SOLDER TO FLOW, DID YOU CHECK YOUR PIN(LEAD)TO HOLE (BARREL) RATIO? N
Electronics Forum | Fri Jan 23 10:31:01 EST 2015 | rgduval
What are the continuing costs on the N2 generator? Is there replaceable media that needs to be monitored/replaced at regular intervals to maintain N2 generation? We're currently using tank-supplied N2, but are just getting ready to fire up our sele
