Electronics Forum: bases (Page 272 of 312)

Dymax vs Humiseal Urethane Confomals.... Anyone?

Electronics Forum | Tue Feb 03 13:39:08 EST 2009 | grics

Good morning Jamie. I work at a CM and can offer some input on process flexability. I do not have any data on how reliable the coating is but I can say that they are both very difficult to control. Will you be selective coating or full coating? Ho

new OMRON VT-RNS-pt PCB Inspection

Electronics Forum | Sat Apr 21 07:05:32 EDT 2012 | doremi

Hello sergio, Probably it is too late to answer to your question, but I can not withstand to say some good words about Omron AOI. I'm located in Europe, 6 years ago our company wanted to make some Japanese manufacturers like Mazda & Toyota our client

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Paste Dispensing

Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F

John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa

Re: PCB Material selection

Electronics Forum | Mon Jun 26 20:34:14 EDT 2000 | Dave F

Gary: Allow expand on this topic a bit. Back in the gray skied past when people wore calculators on their belts, rather than pagers n Palms, and didn�t drink California spill, they used HASS that you mentioned and HALT (Highly Accelerated Life Test

Re: Workmanship Standards

Electronics Forum | Mon Apr 10 22:32:14 EDT 2000 | Dave F

Mark: If you're looking for a baseline document for judging the acceptability of: * Mechanical assembly * Component installation * Soldering * Cleanliness * Marking * Coating * Laminate condition * Discrete wiring * Surface mounting of components .

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Paste Dispensing

Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F

John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa

The ever-expanding reference library

Electronics Forum | Tue Jan 30 21:20:08 EST 2001 | davef

Juran�s "Quality Control Handbook" [McGraw Hill] is an excellent resource. It is, by and large, accessible by those who are not conversant in the Central Limit Theorem [like who is?], although it will help explain whatever that thing is that I just

Solder Paste Volume

Electronics Forum | Wed Apr 11 16:02:21 EDT 2001 | stevearneson

Let me put my two cents into this argument..After being part of many extensive studies conducted to determine the benefits of solder paste inspection, there has never been a case where the customer concluded that paste inspection (Height or Volume)wa


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