Electronics Forum | Tue Feb 03 03:57:37 EST 2009 | sachu_70
Hi George, I would suggest you to re-look your process parameters, especially for the pre-heat temperatures and the amount of flux deposited. The mask properties and that of your flux also play a role, but you could zero down to the root cause after
Electronics Forum | Tue Feb 17 22:49:14 EST 2009 | davef
Try: acrylic adhesive Klapton tape [google for a source] It too is more expensive than the silicone adhesive tape. So, your buyer will keep trying to sneak the cheapo stuff in on you. We had to write a procurement specification and they still wont q
Electronics Forum | Tue Feb 24 14:08:46 EST 2009 | swag
I think you are too hot out of the gate as well as too slow on conveyor. I think settings similar to 130, 140, 150, 160, 230, 240, 260 and conveyor speed at about 28 or 29 IPM would be more realistic but it depends on your paste and oven config/zone
Electronics Forum | Fri Oct 23 15:43:31 EDT 2009 | seankim10
According to 5.2.6.1, it states that defected if Solder balls are not entrapped in no-clean residue or conformal coating. How do you define entrapment or how do you assess if the balls won't dislodge under normal product service environment? The sold
Electronics Forum | Thu Mar 26 21:03:24 EDT 2009 | bigdaddysoy9
I have noticed this on some of our large multi-circuit panels. It's such a slight rise in our false call rate that I haven't really explored it. I'm just guessing that it has something to do with the fiducials calculating the twist/shrink of the boar
Electronics Forum | Mon Mar 23 13:21:32 EDT 2009 | joeherz
We have recently installed a selective solder machine that is running SN100C alloy. Based on the fact that the pot maintenance is done inside the equipment where adequate ventilation is present and we aren't dealing with lead, I don't see the need f
Electronics Forum | Thu Apr 30 14:41:46 EDT 2009 | bandjwet
There was a paper recently presented by R Cirimele at the CALCE Reliability symposium in which extensive testing was done on a part (thermal stress, vibration, shock) after numerous reballing cycles. This show no failures on the reballed parts. In t
Electronics Forum | Tue Apr 28 09:06:19 EDT 2009 | nibirta
Well the only spec is 10.88% flux, 89.12% metal. the problem is only at one specific capacitor we have this issue. Sn over Ni finish. Sn-Ag solder paste. I have read all the arhives from the site, but nothing explains me what is happening.everything
Electronics Forum | Fri May 01 08:16:09 EDT 2009 | kpm135
No reason it wouldn't. Our convection ovens are based on the exact same concepts that pizza places convection ovens are. Just probably on higher power scale. Heck you could probably even use a thermal profiler to get a good recipe down. However I do
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
