Electronics Forum | Tue May 26 15:53:39 EDT 1998 | Chrys
| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to
Electronics Forum | Tue May 26 16:35:53 EDT 1998 | Ryan Jennens
| | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized
Electronics Forum | Wed May 27 10:15:52 EDT 1998 | Doug Romm
Just wanted to add a few comments on the discussion of how to identify palladium parts. Generally, there is no "clear-cut" way to identify Pd versus Sn/Pb. It mainly comes with experience. Any part that is is plated prior to being trim/formed will
Electronics Forum | Fri Jun 26 13:52:05 EDT 1998 | jcc
| We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision sys
Electronics Forum | Tue Jun 09 00:31:56 EDT 1998 | Dave McDermid
| We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision sys
Electronics Forum | Thu May 21 22:19:11 EDT 1998 | Steve Gregory
I hear ya' Earl! I don't know why there seems to be such a push for us to eliminate lead...you're right, assemblers are pretty clean when it comes to lead....actually, the whole industry is, when compared to other industries and the amounts of lead t
Electronics Forum | Fri May 29 22:03:49 EDT 1998 | Tom Gervascio
| | Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. | | Someone from the manufacturer read it and contacted me. He told me the problem has
Electronics Forum | Tue Jun 09 00:53:06 EDT 1998 | Dave M
| | | Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. | | | Someone from the manufacturer read it and contacted me. He told me the problem
Electronics Forum | Fri Apr 17 16:00:52 EDT 1998 | Michael Allen
X-ray can be helpful in trouble-shooting BGA component failures. Test techs can quickly determine whether or not a BGA has solder bridges. When a bridge is found, this can eliminate hours of trouble-shooting. And when a bridge is not found, the te
Electronics Forum | Sun Apr 05 09:46:47 EDT 1998 | Earl Moon
| We are looking at reflow soldering some Flexi-rigid | pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. | Does anyone have any info. The thermal problems associated with polyimide rigid/flex de
