Electronics Forum | Wed Jan 02 04:05:46 EST 2002 | ianchan
Well usually QA keeps the COC and x-section samples, for a designated minimum time period of 6 months, this time period is not set in stone and is defined by your ISO records retention period...each company bears varient importance to the retention o
Electronics Forum | Thu Aug 29 20:02:58 EDT 2002 | davef
Often assemblers leave areas unsoldered for future component additions, modifications, and test points. On imm silver boards, these unsoldered areas become a real bear to solder/test later in life. One way to avoid that problem is deposit some solder
Electronics Forum | Fri Aug 30 04:44:31 EDT 2002 | jason
Hi Dave, Why does it become " a bear" if u leave it unsoldered ?? Does it oxidise or something ?? Question (1): Does Ag imm. PCB need to use Solder paste with AG ?? If yes, why. Question (2): Does Ag imm pcb have poorer surface finishes than HAS
Electronics Forum | Thu Jun 19 12:47:47 EDT 2003 | russ
I would believe that the connector spec is for the max temp that it can withstand while the paste is the max temp that you need to achieve. Solder balls are usually from excessive ramp rates in the oven. I would contact the connector mfg. and see wh
Electronics Forum | Thu Dec 11 23:38:44 EST 2003 | liang
Thank you Stefan for your help! our machine is hs50.you are right we means components are not placed on board.we can found the part around the loctation.i found bearing is dirty.i clean it with threebond.it can work well. but i want to know the rootc
Electronics Forum | Fri Jun 25 18:57:21 EDT 2004 | Pete
One word of caution, depending on the complexity of the boards and package, the Xray on Jewel Box may not be powerful enough to show the voiding defects within the solder sphere. We ran a board side by side against a high end system and find that out
Electronics Forum | Thu Sep 30 08:08:50 EDT 2004 | davef
Habba: Here is a thread from the fine SMTnet Archives from a couple of weeks ago, where we spoke about the topic of mixed lead-free solder with components that have lead-bearing solderability protection: http://www.smtnet.com/forums/Index.cfm?CFApp=
Electronics Forum | Thu Sep 30 09:49:54 EDT 2004 | davef
Armin Habba could be considering a situation where: after they convert to no-lead they receive components with lead-bearing solderability protection from their component supplier. This could happen when: * Supplier has not converted to no-lead. * O
Electronics Forum | Thu Oct 21 17:05:11 EDT 2004 | davef
While it's not exactly what you asked, it's similar. Here is a thread from the fine SMTnet Archives from a couple of weeks ago, where we spoke about the topic of mixed lead-free solder with components that have lead-bearing solderability protection:
Electronics Forum | Thu Apr 14 05:20:58 EDT 2005 | aj
All, I am considering trying out the above to try and eliminate some of my defects on the wave process aswell as reducing cycle time etc. Incase of unfamiliarity with what it is : basically there is a Solder Preform present on the Header/Connector a
