Electronics Forum: because (Page 139 of 444)

Looking for data on hand placed production component?

Electronics Forum | Thu Mar 07 02:33:44 EST 2002 | cmay

I agree with Dave. The only reliable way is to perform a time study using a watch with decimal minutes. Setup the study using an average rated operator and time 10 component insertions (from pick up to hands off), time 10 component soldering operati

adhesive on pads

Electronics Forum | Tue Apr 02 11:50:58 EST 2002 | slthomas

"Oh. [Howabout if I smack you?]" Like I ever said anything 'bout strings. Sheesh. I'm gonna save this one for future reference. Oughta take a week or two to figure out whether yer trying to make a fool of me or not. ;) Criminy. And I was think

Selective wave selection

Electronics Forum | Tue Apr 16 15:01:55 EDT 2002 | wf

Have you considered point-to-point selective soldering using microflame ? If we look at the excellent points that Dave made.... The clearance required for the microflame is minimal, no tooling plate is required - only to fixture the parts and the p

Converting Package Info.

Electronics Forum | Tue Apr 02 15:57:25 EST 2002 | jax

That's what I was thinking when I started the project. Turns out for each part the rendering is an OLE object. Even if I was able to write a script to access the package editor inside CircuitCam I wouldn't be able to create new files. I assume this i

Reflow profile negative temp ramp rates

Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef

Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping

Universal instruments registration

Electronics Forum | Fri Apr 19 13:28:39 EDT 2002 | pjc

To CS: If you "build" in this cost for telephone support on new and recond machines, because that's all we're talking about here since you are being paid for parts and field service, and the original purchaser sells the machine then they won't be ca

QP-132E // FCM 2

Electronics Forum | Fri May 03 01:25:33 EDT 2002 | gerits

Dear Sir, I do not want to mix in this "subjective" discussion but as an employee of Assembl�on (buider of FCM II, FCM multiflex 50, 75, 100) I can provide you with MTTR, MTBF, placement data (0201), software, and other (also customer) data on our e

Solder paste for RF boards

Electronics Forum | Mon Apr 15 18:58:10 EDT 2002 | davef

Problems using NC in RF circuits are peculiar. Depending on the situation [ie, circuit layout, frequency of use, processes used, materials, and what not], a particular NC flux may not work with a RF circuit. Various NC fluxes leave different levels

Profile for Glue "SOMAKOTE IR-130"?

Electronics Forum | Sun Apr 21 09:34:03 EDT 2002 | hany_khoga

Dear all: We need to glue some chip capacitors (0603 & 0805) before continuing the process of placing the topside SMT components. As a subcontractor we received the whole materials including the glue. After experimenting several temperature profiles

double side reflow soldering

Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette

The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to


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