Electronics Forum | Thu Dec 04 07:12:00 EST 2003 | ex maintain leader
Hi Mark, I'm ex Fuji smt service engineer, now I'm leading a a team wich repairs pc-boards in Europe. During replacing P4 processor socket I use an old srt-bga rework staion and an mimistencil wich can be placed abowe the bga pads. My 5 Y experience
Electronics Forum | Tue Jan 13 12:43:24 EST 2004 | cyber_wolf
I have to disagree with Fastek. We only use dedicated tooling on our AP machines. Dedicated tooling pros: *Set up time is 90%+ faster than universal tooling. *It is very easy to train operators to install dedicated support plates. *You do not need
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
Electronics Forum | Fri Jan 30 09:29:22 EST 2004 | caldon
Joe- You confused me In the subject it has SMT and in a posting you say Through hole components. I was incharge of getting equipment for a research and teaching facility called ACI (Some know it as the EMPF). I was tasked with getting equipment at n
Electronics Forum | Wed Jan 28 08:11:20 EST 2004 | stefwitt
Martin, may I ask what your offer is? Does the pick and place machine vendor provide you with a special nozzle, which would not require the peel off cover. Custom nozzles from the OEM are quite expensive, because they implement engineering and test.
Electronics Forum | Thu Feb 12 00:04:21 EST 2004 | fastek
It's the pressure that American CEO's are under to increase profits and please greedy shareholders and analysts that drives them to this result. Companies like Dell racing HP and Gateway to see who can make PC's for free. Companies like Motorola raci
Electronics Forum | Fri Feb 20 08:56:42 EST 2004 | davef
We successfully clean WS flux on 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use no clean, because we cannot remove the flux residue from under them efficiently. Use ion chromatography testing to be sure it is clean under the BGA. IC is the on
Electronics Forum | Thu Mar 18 16:39:14 EST 2004 | Jed Johnson
A few good points have been made here: The profile could be ramping too fast. The profile could be gettting too hot. The profile may need to have more "soak" time before reflow to allow the board temperatue to equalize and the board to "relax" and st
Electronics Forum | Mon Mar 08 15:17:50 EST 2004 | Robert
Need some suggestions on oven profile. I run a BTU VIP98 oven. Has 7 zones, convention heat and all. My profile goes (in Celcius) 150/160/170/180/205/215/180 moving at 28in/min. Roughly 5 minutes from start to finish. I use Kester 256 solder and my b
Electronics Forum | Tue Mar 09 09:31:49 EST 2004 | Robert
Yes, in fact I do have 3 T/C connectors but I've never known how to use them nor what to connect to them. I generally address problems by merely changing the recipe up or down depending on what I see on the board(s). Someone mentioned to use a MOLE b
