Electronics Forum | Wed Jul 01 16:00:54 EDT 2020 | spoiltforchoice
https://smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=22488&#Message84305 Previous thread for reference
Electronics Forum | Thu Jun 25 11:30:18 EDT 2020 | kylehunter
I'd love to see a thread focused on various methodologies used for general inventory management schemes, but primarily on procedures to ensure the proper parts get loaded on the pick and place. We have an Assembleon pick and place, so there is no fe
Electronics Forum | Thu Jun 25 12:05:34 EDT 2020 | spoiltforchoice
There is a fairly recent one. And all the conculsions need things you don't have. Buddy loading - so one person loading one verifying everything. Barcodes - gets rid of people misreading labels mixing up 4k7 with 47K or nbot seeing a decimal point o
Electronics Forum | Mon Jun 29 19:15:19 EDT 2020 | emeto
The only way is to get a whole system that is smart - there are several out there. I had Mycronic towers, Mycronic machines and smart feeders and all is connected together. Plus the machine measures values for all passive components. Once machine mak
Electronics Forum | Tue Jun 30 11:39:21 EDT 2020 | stephendo
The best I saw was two people set up and then two other people verify the set up. They still managed to wrong parts on. Day shift loaded the parts but did not have time for the independent check. Afternoon thought that the second check had been done
Electronics Forum | Tue Jun 30 17:47:57 EDT 2020 | rsatmech
Manual method is always risky. Evening with all sorts of scanning people are loading it wrongly. Below are the recommendations I have. (Kindly comment if anything don't seems to be a solution) 1) peer to peer check - once loaded check the value usin
Electronics Forum | Fri Apr 03 15:30:10 EDT 2009 | ed_faranda
I have a VJE Summit 750 Rework machine... I don't think that matters much, but I put it out there anyway. I am removing a BGA (29mm x 29mm) off a board, but some of the pads on the board are being lifted during the process. Does someone have any
Electronics Forum | Thu Apr 09 07:37:18 EDT 2009 | fowlerchang
Another suggestion for it. Baking the whole boards before rework the BGA. It is not only benifit to the BGA but also to the pad.
Electronics Forum | Thu Apr 09 09:23:29 EDT 2009 | ed_faranda
Well, I did manage to solve this problem. I lowered the max boards temp from 245 to 235. Then I decreased my TAL. This seemed to work perfectly. Thanks everyone for your suggestions! They got me in the right direction.
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
