Electronics Forum: benchtop reflow oven (Page 85 of 322)

Can anyone recommend a reflow profile for already flowed solder?

Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm

As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Sat Sep 12 20:34:05 EDT 1998 | Rick Bell

| | | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents becaus

Time and temp in lead and lead-free reflow

Electronics Forum | Fri Jul 25 15:54:22 EDT 2008 | pcbbuilders

I am trying to optimize my reflow profile. i have a 5 zone oven. lead-free: for the 1st 3 zones, i am good, at about 150-200 deg for 150 seconds. during the 4th zone, i am at a temp of 200-220 for 50 seconds. during the 5th zone, i am at 220-245 f

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Fri Sep 11 14:45:03 EDT 1998 | Earl Moon

| | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because t

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Tue Jan 14 19:41:32 EST 2020 | avillaro2020

Hi Evtimov, Thanks for your response. Yes, the vapour phase is suppose to handle big and heavy boards, at least thats the intention. Well our thin board is like around 3mm which is not really thin. In our application the thicker the boards means more

Rectangular uBGAs with 1 raised edge after reflow

Electronics Forum | Wed Sep 05 14:51:47 EDT 2001 | gdstanton

Well, it appears after running both a bare and populated PWB we were seeing flux exhaustion on the uBGA. The problem apparently resulted by a recent maintenance effort where the air blowers in the reflow oven were replaced. The blower replacement m

component aherence force on the solder paste before reflow

Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte

If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at

cost analysis: Manual vs. Auto insertion pick and place

Electronics Forum | Fri Aug 04 13:47:20 EDT 2006 | pemea1

apples to apples. 20 boards 80 parts top and 10 parts bottom. these boards are done on a semi regular basis (you know the boards are coming to you from an OEM at least three times a month, just no exact schedule). All that is required is pasting..mo

DIMA smro 0406 is good machine or not for doing lead free reflow

Electronics Forum | Thu Dec 11 08:22:26 EST 2014 | emeto

The longer the oven, the better. You will have much more capabilities in creating the precise profiles the way you want them(with10-12 zone oven). I have worked with ovens from 2 to 12 zones and the difference is huge. In my opinion try to get a 10zo

What golves do you use at the end of the reflow oven?

Electronics Forum | Thu Nov 10 14:42:59 EST 2005 | SuMoTe

I need a new set of gloves for my operators at the end of the reflow oven. MUST be ESD safe. What do you use/recomend?


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