Electronics Forum | Thu May 07 10:53:58 EDT 1998 | Ryan
Is there a machine for bending S shaped bends in leads of through-hole components, to keep them off the surface of the board.
Electronics Forum | Wed Apr 11 20:49:39 EDT 2007 | raychamp007
3W. Figure 8-84 shown evidence of heel bend wetting(but no written criteria mention about the solder fillet must present at the heel bend). It is acceptable if the minimum D(3W/75%L)extend from toe which is no evidence of solder fillet at heel bend?
Electronics Forum | Fri Dec 10 09:32:04 EST 1999 | Dave F
Joe: It might be tough to generalize about the number of times you can reform a lead before it is weakened beyond the point of reuse, because of different lead materials, thicknesses, amount of bending etc. It might be that "ugliness" is the answer
Electronics Forum | Thu Jun 10 04:52:36 EDT 1999 | Gyver
Hello all! Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it's the proble
Electronics Forum | Thu Jun 10 04:54:10 EDT 1999 | Gyver
| Hello all! | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it's the pr
Electronics Forum | Wed Jul 30 16:57:23 EDT 2008 | stevek
Folks, I'm looking for some specs for the maximum bend or strain that should be put on a PWB. Not looking at the solderjoints. I'm concerned with localized bending of the fab and what might be a reasonable limit for that bending. I've measured 105
Electronics Forum | Fri May 31 12:28:45 EDT 2019 | slthomas
You really need to define what you mean when you say "bend" and when you say "break". You might have zero damage to a bare board but cracked solder joints and ceramic caps on an assembly, given the same amount of bending or stress. It all depends on
Electronics Forum | Thu Sep 21 09:00:09 EDT 2006 | realchunks
Just a thought. You could always move your thru-hole process if your product permits. "Bend and clip"... I haven't heard that term in years. Are you using bend and clip guns for your thru-hole?
Electronics Forum | Thu Apr 12 20:44:58 EDT 2007 | raychamp007
If the solder joint meeting 8.2.5.4, minimum side joint length(D) and also meeting 8.2.5.6, minimum heel fillet height (F) but the heel fillet NOT extend to the mid point of outside bend. It is acceptable?
Electronics Forum | Fri Apr 13 02:55:47 EDT 2007 | raychamp007
Davef, Thanks for your reply. Also sorry because I didint notice your ealier reply on http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=48991 regarding the normal gull wing lead, the solder fillet must extend to the mid point of outside lead
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