Electronics Forum | Fri Aug 04 09:09:22 EDT 2006 | russ
Aj is right, utilize the homeplate aperture, this reduces the amount of paste actually underneath the component, Pb frees exhibit this mid ship more often than the lead, I think,it is mostly because of thre transition to noclean form water solubles
Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman
Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m
Electronics Forum | Thu May 20 03:45:22 EDT 2021 | jineshjpr
SAC305 Will be the best choice with minimum TAL, Maximum Soak Solder Profile. Surely your solder Joint strength also will be more reliable & This can pass any kind of reliable Tests.
Electronics Forum | Mon Aug 14 12:08:35 EDT 2006 | cuculi54986@yahoo.com
I agree with using the homeplate design on chips. Some Pb-free solder paste manufacturers recommend 1:1 apertures. This, in my experience, is not a good idea with any of the SAC305 pastes I've tried. I've been using the same stencil design guideli
Electronics Forum | Tue Jun 20 09:28:30 EDT 2006 | cuculi54986@yahoo.com
We evaluated four SAC305 pastes. Of the four, we found Alpha OM-338 to appear to have the least flux residue. We also found it to be the most dull, least shiny, most non-SnPb looking of the four.
Electronics Forum | Tue Sep 16 16:45:44 EDT 2008 | trynders
Thanks for the response! I thought is was odd the component vendor chose SAC for a lead frame finish. I am in the Military world, and things have been difficult to control from a lead-free standpoint. I have not been able to find any studies on SAC
Electronics Forum | Wed Sep 24 19:18:53 EDT 2008 | ratsalad
We had a PCB vendor provide us with SAC105 plated HASL boards. They worked fine on the first pass through reflow. The second pass was not pretty. We couldn't get much of anything to solder to the board. That may not have been the alloy, it could
Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip
Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an
Electronics Forum | Sat Apr 21 14:50:17 EDT 2012 | edmentzer
We are using SN100C in both our wave and selective machines and have very good results. We also using it for ROHS hand soldering. It flows better than SAC305, the joints are shinny just like Sn63/37. We are looking into using SN100C as our paste b
Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman
Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing
