Electronics Forum | Thu May 29 17:19:51 EDT 2008 | dyoungquist
On 0402s we use 20x25 mil pads with a 15 mil gap between the pads on the pcb with ENIG finish, 5 mil stencil with a 1:1 aperture (20x25 mil) and SAC305 lead free solder paste. We very rarely see any tombstoning on 0402s using this setup.
Electronics Forum | Tue Sep 16 16:30:49 EDT 2008 | ck_the_flip
Vlad, yes, he made no mention of a BGA, but I thought I'd just throw it in there. Many people are concerned with the "backward compatible" scenario - running RoHS parts with a Sn/Pb solder paste. The scenario's a no-brainer with most components, bu
Electronics Forum | Sat Aug 03 03:28:16 EDT 2019 | alexeyzb
We use SNPb for such applications (PCBA for aircraft). We tried SAC305 but recieve no good quality, so now only SNPb. If you will find good solution - please write. Because now we have some problems with BGA - no SNPb balls. And need to reball (addit
Electronics Forum | Fri Oct 02 11:23:08 EDT 2009 | floydf
Does anyone out there have experience soldering > with Pb solder (Sn 63 or Sn 62) to SAC 305 coated > PCB lands (about 50um) or Sn-Cu plated lands > (about 10um). I know soldering Pb free (Sac based > soler) to Pb/Sn coated lands is a no-no, but
Electronics Forum | Mon Oct 22 05:04:08 EDT 2007 | jkhiew
Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We
Electronics Forum | Tue Apr 05 15:32:49 EDT 2011 | grahamcooper22
It is one of our pastes...Almit LFM48 W TM-HP, a high reliability no clean solder paste based on SAC305 with a size 4 powder. It's a paste that works so well we have thousands of users of it worldwide. Why are you using SN100C alloy paste ? I imagin
Electronics Forum | Wed Feb 08 03:44:28 EST 2006 | fctassembly
Hello Amol, I continue to be amazed at the surprise engineers have on discovering that a non-eutectic alloy such as SAC305 displays micro-cracking and rough joints in a soldering process. There was a reason the electronics industry chose to use eutec
Electronics Forum | Tue Jan 15 11:50:17 EST 2008 | pbarton
We too are trialling WS819 with SAC305 alloy. The foaming in cleaning causes us a headache but all other attributes seem much improved over earlier types. Previously we were using WS619 - no foaming issues but MUCH shorter stencil life (less than 4 h
Electronics Forum | Mon May 15 04:33:35 EDT 2006 | Rob
Hi Steve, Although your opinion is valid, calling something from a respected Japanese manufacturer crap is a little harsh. I have seen many people solder very well with all sorts of leadfree alloys - not producing crap. I've already had a play wit
Electronics Forum | Thu Jan 03 14:01:24 EST 2008 | fsw
Davef, thnx for your reply. Sorry, forgot to clarify "our normal soldering process". We use standard Sn/Pb & SAC305 for our non RoHS & RoHS requirements. We only have a "No Clean" process, no aqueous flux is used. Hence our flux will be mild. As susp
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