Electronics Forum | Fri May 14 05:50:26 EDT 2021 | williamrobbins
I've only used vacuum reflow on LED boards but I have heard that Vacuum may need to be reduced depending on components. I can't find the source at the moment but it was a study done by Heller I believe. I would experiment with different levels of v
Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Mon May 27 04:28:30 EDT 2019 | SMTA-Rogers
Dear Steve, Thanks for your feedback in our experience add solder paste volume is better for the voids reduce of LED type components.
Electronics Forum | Mon May 06 06:22:39 EDT 2019 | SMTA-Rogers
Hello! Do you have a better stencil design to reduce the large area of solder joint voids? Or is there a suggested way to set the reflow profile? Or are there other process improvements to make the solder joint at the LED pad less than 10% per void?
Electronics Forum | Mon May 06 11:45:32 EDT 2019 | slthomas
There are quite a few papers out there on the subject. Just enter "SMT void reduction" into google or other search engine and take your pick. That said, slow ramp rates and paste volume reduction are a good place to start. Although I haven't tried i
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Electronics Forum | Wed May 02 13:02:14 EDT 2018 | emeto
Based on the pickup surface area: 1. Use the biggest nozzle possible, 2.Keep in mind that some nozzles have bigger inside diameter hole(more vacuum) 3. Keep in mind that some pickup surfaces are rigid(not really flat surface) - use rubber tip nozzles
Electronics Forum | Tue Jan 09 08:46:03 EST 2018 | pavel_murtishev
Hi, "Baker with controlled humidity 5%" is actually dry cabinet. Using of dry cabinets i.e. ambient temperature baking is preferred. Vacuum will always be better. If you are going to use vacuum chamber, that will be the best method in my opinion.
Electronics Forum | Mon Sep 11 08:22:56 EDT 2023 | richardcargill
A lot of MELF components have solder ends that stand slightly proud of the main body where your vacuum would lift them, so vacuum leaks are most likely the culprit. Upping the Vacuum to the nozzle may help, but better thing would be to modify the noz
