Electronics Forum | Thu Apr 10 09:28:14 EDT 2003 | chrissieneale
Thanks for your replies guys, there's some good info there. Dave, answers to your questions: The stencil was initially a big problem as with the Egineering Model's (EM's) and Engineering Qualifing model (EQM's) we kept getting short circuits due to
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Mon Oct 30 13:26:09 EST 2000 | stefano bolleri
Ramon, I have placed BGAs before with an IP-2. It can be done, but with limitations: IP-2 can only see shape of BGAs, not balls (back-light only). Is this OK for you? I only placed components with balls having 50mil pitch, and the centering with bod
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
Electronics Forum | Sat Jan 08 11:12:49 EST 2000 | S. Evers
Hi all, Best Thing Since Sliced Bread? No doubt many of you have seen Phil Zarrow's "over-the-top" review in Circuits Assembly of the new Ersa scope, a device that allows viewing a really neat close up a side view of the component substrate interface
Electronics Forum | Tue Sep 28 10:29:11 EDT 1999 | Earl Moon
| Dear all, | | We've got a curious problem. We have had a major problem with BGA's occasionally being placed one to several rows or columns off the pads. We are using Universal's GSM2 platform for our general purpose placements. Our Universal re
Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
