Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Mon Aug 31 22:30:09 EDT 1998 | Kelly Morris
We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. The center
Electronics Forum | Tue Sep 01 19:16:51 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman
We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl
Electronics Forum | Tue Jun 09 09:28:57 EDT 1998 | Earl Moon
| | If any one needs a procedure for rework and repair of BGA there is a document on my Web Site to download www.bobwillis.co.uk | | | What methods do people use to dress pads after removing and before replacing the BGA? | | | We use solder wick and
Electronics Forum | Thu Jun 04 16:14:04 EDT 1998 | Terry Burnette
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F We've bee
Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon
| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I
Electronics Forum | Thu Feb 19 22:11:35 EST 1998 | Brian Morgan
| We are in need of a low cost system for the rework of | various SMT devices. Ideally the machine should support BGA, | SQFP, and large PLCCs. | Is it a dream to ask for SMT tweezers, a regular iron, | and a convection pencil as well? Want a machin
Electronics Forum | Tue Aug 21 03:42:55 EDT 2001 | mugen
SMT community, My Fellows, 1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? 2) why is water-soluble (WS) not a hot choice? 3) All I know, *is in layman terms*, that BGA has tendency to trap water, should WS process be the c
Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold
We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout
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