Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef
That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl
Electronics Forum | Mon Feb 11 21:54:14 EST 2002 | davef
LONG TERM Your plans to buy a vaccuum bag resealer and a batch drying oven sound good as you say, but you�re correct. They will not help with this current situation. SHORT TERM If your connections are clean, free of pits and holes with a smooth,
Electronics Forum | Wed Mar 20 13:54:56 EST 2002 | Aaron C
I am starting to use BGAs more and more in our process, which is using water soluble paste. Taking to the Paste Rep, he had pointed out that if you add Surfactant Packs to your inline water wash, that it would help get the water underneath the BGA pa
Electronics Forum | Fri Apr 12 08:40:13 EDT 2002 | Alan
Steve, I have done BGA work with and with-out Xray. If you are going to install them in high volume it makes sence to have every thing including rework on site. If you are just going to put down several a week you can probably get away without th
Electronics Forum | Wed Apr 24 10:32:47 EDT 2002 | dougt
BGA's are sometimes difficult for a camera to recogonize as your not looking for the dark outline of a part with white lighting behind it but rather the white balls with in that dark component. If you don't mind experimenting a little I would play wi
Electronics Forum | Tue May 28 09:27:04 EDT 2002 | pjc
Does this PBGA have eutectic balls? If so and the PCB is HASL finish, or has solder on the lands from BGA removal, you may not have to apply solderpaste. Check with you flux supplier to see if they offer a NC "flux paste" product, otherwise I know Mu
Electronics Forum | Tue Jul 02 08:59:14 EDT 2002 | jax
On an IP3, from what I remember, the BGA Part data is defined from center part moving out towards part edge. If your pick up point is a little off this problem can occur. Otherwise, Check your gain and offset settings. The machine is probably recogni
Electronics Forum | Mon Oct 14 03:14:08 EDT 2002 | msimkin
Hi, Has anyone had expereince in the design or use of mini rework srtencils for uBGA applications? What was the deisgn guide lines used. I am looking to rework 0.7 & 0.65 mm uBGA parts with standard hot air, without split prism placement guides. It i
Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef
First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments
Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg
Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part
