Electronics Forum | Fri Jun 16 15:05:29 EDT 2006 | grantp
Hi, We ran some boards and the girl on the line put in some Pb BGA's instead of using RoHS parts. This should not have happened as we have almost no Pb parts left, and we spray painted Pb parts fluorescent pink so it was obvious. The boards seem t
Electronics Forum | Tue Jun 20 11:31:15 EDT 2006 | muse95
This has been debated several times on this forum, but I have to say the opposite of Samir. I would rather see a SnPb BGA in a Pbfree process(as long as the component can take the heat) than a Pbfree BGA in a SnPb process. There has been some mention
Electronics Forum | Wed Jun 21 13:25:16 EDT 2006 | muse95
I see what you're saying - I'm not a process guru by any means. I was going on the premise that SAC melts at a higher temperature than SnPb. Basically I think of it as a BGA is joining solder to solder, unlike an SOIC where it is tinned metal lead t
Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Wed Nov 08 08:48:45 EST 2006 | markhoch
Okay, here's the deal-e-o....I need to find the Nation's Best BGA Rework Specialists. I have 50 PCBs each measuring about one square inch, that need to have a BGA Ring Socket Removed, eight capacitors removed, and a new ring socket installed. Sounds
Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne
Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Mon Apr 30 09:55:50 EDT 2007 | rgduval
We're running an older TP9-U, and clocking in somewhere around 3000 cph, realistically. Placements, however, are very accurate. Works fine down to 0402's, high-pin count QFPs, etc. My -U doesn't do great on optical centering...it works, but it's a
Electronics Forum | Mon Aug 13 05:39:31 EDT 2007 | saaitk
I am building a double sided SMT board. On the first side I have a 405 ball BGA. When we build and run the second side through our reflow oven on about 25% of the boards run the 405 ball BGA on the underside of the board has fallen off. About 80% of
