Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Wed Dec 03 14:17:50 EST 2008 | muse95
I am not disputing that cotton gloves are a good idea. They can help protect a lot of parts and surfaces (if the gloves are kept in good clean condition, that is, but that is a whole 'nother thread topic). The fact of the matter is though, paper w
Electronics Forum | Tue Feb 03 14:19:29 EST 2009 | grics
I would agree if you have a board to setup the process. But sometimes this doesn't work... If for some reason if the customers AVL has a Lead Free BGA and I am running Leaded paste (yes this really happens!), you will need to run hotter to get your
Electronics Forum | Tue Mar 24 17:14:44 EDT 2009 | bas251
In my experience, before my current employment, I have personally seen damage from the water soluable fluxes left under a BGA. In consideration, I have not seen it from an assembly process where the boards are cleaned thoughly, but I have seen it dur
Electronics Forum | Thu Oct 01 07:03:55 EDT 2009 | davef
We doubt that Humiseal 1A33 is causing opens in your assemblies. We'd guess the opens occur earlier in the process, but are not hard failures. So, you pass your tests. When applied, the conformal coat flows into the gap in the ball crack and insulate
Electronics Forum | Tue Sep 14 14:07:45 EDT 2010 | grahamcooper22
Hi Gani, HASL is normally very good for solderability providing there is a good consistent coating of HASL on the pcb pad. But it is not unusual to have a very thin coating of HASL on the pad and this is poor for solderability. You then have tin/copp
Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon
Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your
Electronics Forum | Thu Jan 27 04:02:00 EST 2011 | richiereilly1
Hi, We had a similar issue to this. When we examined the boards at x-ray there were no apparent defects, We sent the boards for Dye and pry testing and we found that there were crack or gaps between the paste on the PCB and the BGA ball. basically th
Electronics Forum | Thu Sep 19 11:02:17 EDT 2013 | hegemon
If there is only a single lead free BGA on the BOM, I would suggest a "hybrid" profile. Use regular solderpaste (SN63/pb37) and peak your temperature at around 225C. Allow a bit longer TAL to let the two solders co-mingle at the BGA joints. You are
Electronics Forum | Wed May 28 19:21:09 EDT 2014 | hegemon
Just from the look of things (a picture) I would first guess it is a contamination problem on the PWB. Check over all your handling practices. Make sure the PWBs are NEVER touched by bare hands. I would not rule out the Black Pad phenomena, but i
.jpg)
