Electronics Forum | Tue Apr 25 22:59:59 EDT 2000 | armin
If I were you, I would divide my boards into categories...and I'll categorize them by their components e.g. Bds with BGA, with QFP, Bds. with plain chip components...and so on...this is to create a recipe for each components with QFP's, BGA's etc...t
Electronics Forum | Tue Apr 11 08:57:35 EDT 2000 | Alfred
Can you get me a recommendation regarding a Micro BGA soldering. It is apparent there is a problem and I want to insure success by following recommended practices. Is there a particular solder mask configuration recommended, as far as stencil thick
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Tue Jan 16 13:47:24 EST 2001 | cebukid
10% on various BGA packages. I checked the profile and we are getting "ideal" reflow conditions (~ 60 sec. T.A.L.). Ramp rates, temperature deltas before spike zone, and cooling rates are ideal too. I don't believe it's a profile, print, or paste
Electronics Forum | Wed Feb 14 15:55:31 EST 2001 | Antonio
Fellas, Here's the deal. We're getting shorts on a limited number of boards under the BGAs; about 1 out of 6 boards. The thing is that these boards have about 10 BGAs on them. On the one out of six boards with shorts, the shorts are everywhere and
Electronics Forum | Tue Feb 20 07:31:45 EST 2001 | Nick L
0.076 ~ 0.2 um(micron) but our substrate gold thickness is between 0.3~1.2um. Is there any related to the plating process of substrate! And how can they control this thickness?(May be I should ask substrate vendor their controlling limit). If this i
Electronics Forum | Wed Feb 28 09:53:17 EST 2001 | fkurisu
Hello Dave, Solder mask rework has been performed on both bare and populated boards. There are factors that come into play with a populated board that make this type of rework more difficult, such as the density of components(especially around th
Electronics Forum | Tue Mar 13 11:13:05 EST 2001 | blair
Hi: We are about to build a batch of highly critical control cards with 5 BGA on them. We just recently had a significantly bad yield at our subcontractor in the San Jose area. We feel it is in the reflow profile that was used but are not 100% sur
Electronics Forum | Wed Apr 25 10:37:14 EDT 2001 | davef
If you heat a BGA too quickly, the corners of the device will curl towards the ceiling [potato chip], because they come to temperature faster that other areas. Adding to this, thinner substrates tend to potato chip more and faster than thicker subst
Electronics Forum | Tue Sep 19 14:40:13 EDT 2000 | Erick Russell
It is always a good idea to heat the entire board to 100C to 140C prior to reflowing the site to be reworked to reduce warp and localized stress. (Thermal uniformity of the preheater is key here). For a BGA, the laser is programmed to heat only the
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