Electronics Forum | Tue Jun 05 12:55:54 EDT 2001 | JoAnn
Although I don't know the answer to this I am sure one of these people could help you. They are all members of the SMTA with a great deal of BGA rework experience. Doug and Ed both teach rework classes for us. If you are interested in a BGA rework
Electronics Forum | Wed Jun 06 13:38:15 EDT 2001 | Michael Parker
To expand on Wolfgangs reply, I suggest you contact your local SRT rep. We recently had the same type of problem as yourself. This is the path we followed. Arrange for operator training, for yourself first, then the operators after you get the machi
Electronics Forum | Thu Jun 07 07:11:41 EDT 2001 | stefwitt
8" ). For calculation of the theta angle, the global fiducials should be placed over the diagonal. Component recognition can be improved if your vision system has different light zones. The steep light should be turned off and the flat light turned
Electronics Forum | Wed Jun 13 03:37:06 EDT 2001 | ianchan
Hi mates, I did a recent shear test (destructive test), on a uBGA liken product, and noted the post-shear solder joint, had clean "smooth" visual appearance under the uBGA pad, however the matching pcb pad was clearly lifted clean. Question: 1) how
Electronics Forum | Tue Jun 19 10:59:21 EDT 2001 | Gil Zweig
When x-ray inspecting BGA packages with metal heat spreaders tube voltages greater than those used for Plastic BGAs must be used. It must be recognized, however, that the tube votage required will depend on the particular sensitivity of the x-ray cam
Electronics Forum | Mon Jun 25 20:51:43 EDT 2001 | davef
Well, the paste must be OK, because other components don�t have this problem. The board must be OK, because other components don�t have this problem. So, it must be either the component or the profile. I�d speculate that you need to do some work t
Electronics Forum | Tue Jun 26 20:40:36 EDT 2001 | davef
Your profile seems reasonable, as you say. As CPI says: Sure it could be planiarity issues with the balls, but that is not something that makes me want to do a Pete Rose belly-flop, head-first slide into first base that this is the source of your p
Electronics Forum | Fri Jul 13 00:11:41 EDT 2001 | qinongzhu
We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and ca
Electronics Forum | Sat Jul 28 10:51:38 EDT 2001 | nifhail
I'm curious over what would happen if we continue to use the WS paste when dealing with uBGA. Definitely the cured flux under uBGA package couldn't be cleaned/reached and as I understand correctly they are corrosive. if that so, how long do you guys
Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
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