Electronics Forum | Sat May 22 19:38:59 EDT 1999 | Omat Marasigan
| Earl, | | your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? | | anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of
Electronics Forum | Tue Dec 29 22:31:06 EST 1998 | Kelvin Chow
It is still a big concern on using No-clean or aqueous cleaning for CSP assembly. I prefer to use no-clean, however, not all components are suitable to use it. Especially those dirty capacitors or connectors which may cause solderability problem. It
Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen
I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w
Electronics Forum | Mon Oct 19 12:03:09 EDT 1998 | Scott Cook
Out of interest, are you using an 84V? 84VZ? a 60V? 60VZ? With SBIP or the Yamaha vision system (VICS 1000)? Do you have the old tray sequencer? > WRONG!!!! Why do folks still live in this mindset? I'm not slamming you personally. But this is preva
Electronics Forum | Wed Oct 21 21:27:32 EDT 1998 | smd
| | WRONG!!!! | Why do folks still live in this mindset? I'm not slamming you personally. But this is prevalent in our industry. | More opinion: | Make REWORK a nasty, dirty word. Work for the ROOT cause of a process problem. DO NOT ACCEPT rework a
Electronics Forum | Thu Aug 27 15:40:50 EDT 1998 | Justin Medernach
| | | | | Hi, | | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | | We have rule out the possibility of not p
Electronics Forum | Wed Jun 10 17:30:44 EDT 1998 | FAC
When creating part data�s for BGA or QFP style components, the line scan camera will be utilized (Camera No. 4). Using a Single nozzle type placing head, a nozzle capable of sufficient vacuum, and front lighting the part can achieve placement of a 74
Electronics Forum | Thu Mar 05 23:52:26 EST 1998 | Ron Costa
| Hi Ron, | Your question really opens up a "Pandora's box", but when you say you're not able to print perfectly, what is it exactly that you mean? Is the print lacking volume? Is it mis-registered? Are you bridging? Also, what printers have you used
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
