Electronics Forum | Fri Apr 24 07:55:12 EDT 2009 | davef
TOMBSTONING OF 0402 AND 0201 COMPONENTS: "A STUDY EXAMINING THE EFFECTS OF VARIOUS PROCESS AND DESIGN PARAMETERS ON ULTRA-SMALL PASSIVE DEVICES" Michael Yuen, Heather Benedict, Kris Havlovitz, and Tim Pitsch, Plexus Electronic Assembly Corporation, N
Electronics Forum | Fri Jul 06 09:39:18 EDT 2001 | johnw
Hi guys I am having problems with skewed placement of 0402 devices I would like to add the board has raised pads and we are placing on glue. We are now printing the glue rather that dispensing with a GL5. have any of you guys had this pro
Electronics Forum | Mon Jan 12 02:45:53 EST 2009 | sachu_70
Hi Stefano, Although your concept of Wave soldering such devices is possible, I would look at an alternate solution. An easier way would be to Reflow solder all Bottom side SMD components with solder paste, followed by wave soldering for only through
Electronics Forum | Mon Jun 18 22:04:01 EDT 2001 | davef
YA DON NEDA YELL!!! AHYAINT DAFF YANO!!! Printing adhesive near fine pitch devices can risky. Be careful. Look here to get started: http://www.alphametals.com/products/techarticles/soldrpstncl/guidelines.html [I know this link is expired, but may
Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork
I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi
Electronics Forum | Mon Apr 17 22:54:51 EDT 2006 | Darby
Short answer is - not really. According to the manual in Chapter 1-5 Supply devices (Feeders) overview "There are also available an 8mm tape feeder which handles 1005(0402) square chips". I have never seen one. The problem is that even an H nozzle is
Electronics Forum | Mon Sep 23 07:00:36 EDT 2019 | uzbek
Thank you for the detailed response. This FLX is laser-based alignment but we can buy a camera module (FLX-VIS) from the same distributor. The exact PN of the machine is FLX2011 LC. The complexity of boards is components with cases: QFN, QFP, BGA,
Electronics Forum | Thu Jun 24 12:30:06 EDT 2004 | deonn
Thank you for your input Russ. I do understand the technical challenges that 0402-0201 present. As a matter of fact, I personally think it is a bad idea for these devices to even be processed using conventional assembly methods when the alternative
Electronics Forum | Thu Jun 24 09:24:03 EDT 2004 | Rob
The smallest component we use is 0402. Solder paste is Kester 256. Printer is MPM Ultraprint 2000. Stencil is 6 mil. I didn't here anything bad (rework or whatnots) in terms of soldering of those components.
Electronics Forum | Wed Jun 23 19:40:29 EDT 2004 | Deon Nungaray
Quick question for you Netters out there: Anyone out there dispense solder paste (via automated dispenser) for 0402, 0201 and/or uBGA's? If so, success yields, equipment used, and any technical info would be appreciated. This is for a low volume app
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