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Electronics Forum | Tue Jul 18 00:15:37 EDT 2023 | hazira1991
Is a fresh lot. This bga is old date code 2010. we had received this BGA 2021 and the baking process is done during receiving time. Production received with vacuum seal , its very hard to tell how the BGA handling and stuff and the BGA already EOL. I
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah
Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad
Electronics Forum | Fri Oct 06 08:22:05 EDT 2000 | jackofalltrades
BGA's are not difficult, but should be inspected no matter how careful you are. Here we have been doing bga's forever and x-ray 100%. Without an x-ray there is no good way to ensure the BGA is placed properly, without bridging or insufficients. If yo
Electronics Forum | Mon Jul 24 23:34:14 EDT 2000 | rzkr438
I am tyring to find out shear force requirement for BGA attached on board .I measured two group for shear force to check underfill process effectiveness on BGA .Two group showed siginificant force diferrence .I am very sure underfill process is effec
Electronics Forum | Sun Jun 24 05:03:20 EDT 2001 | ronih
Hello, I need some information about footprint of BGA / fine BGA. As far as I know the pad on PCB should be the same as the pad on the BGA (much smaller than the ball dia.). I need some information regarding the hole SMT process: - Paste printing:
Electronics Forum | Tue Feb 25 20:10:33 EST 2003 | davef
First, there is no standard. Next, on one hand, most BGA cost a lot of money. On the other hand, choosing to use reballed BGA in products for shipment depends on how well you expect to meet your customers' expectations about product reliability wit
Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen
Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note
Electronics Forum | Fri Apr 16 04:19:28 EDT 2004 | denis_s
Hi, I've a problem with a BGA. I've the impression that the balls broke then there is a too big mecanical stress on the PCB. I lost some dBm and when I press on the BGA I measure the good value! It's like the balls are take off the BGA or PCB and wh
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