Electronics Forum | Thu Apr 12 07:46:20 EDT 2007 | realchunks
Hi aram, Hot air is best. IR takes longer and is affected by the color of the part. Best post solder process that affects solder the most is handling.
Electronics Forum | Thu Apr 19 07:26:42 EDT 2007 | bartlozie
Hello, I was talking about the PACE TF 2700 rework station. price about 25.000 euro. kind regards
Electronics Forum | Tue May 01 09:51:51 EDT 2007 | slthomas
Where are you measuring your temperature at? Are you measuring pad/ball interface temp through a hole in the board, or a lead on a different part, or board surface, or.....?
Electronics Forum | Wed May 02 07:47:21 EDT 2007 | Bob R.
Don't dink with the profile until you have evidence that the profile has something to do with the problem. Step 1 is a cross-section. Where are the joints breaking? Do the joints show signs of proper wetting & intermetallic formation?
Electronics Forum | Fri May 04 12:18:46 EDT 2007 | ck_the_flip
For the mixed alloy scenario, here's something from the fine SMTNet archives: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10216&#Message40990
Electronics Forum | Wed May 30 13:54:57 EDT 2007 | rgduval
Jeremy, Would socketing the chip help you guys out at all? One of the sales rep's I use also rep's a company that builds custom sockets/interface boards for BGA packages. I can get their info, if you're interested. cheers ..rob
Electronics Forum | Thu May 31 21:43:21 EDT 2007 | davef
Most suppliers provide this information on their parts. For example http://www.altera.com/literature/an/an114.pdf We have no relationship, nor receive benefit from the company referenced above.
Electronics Forum | Wed Jun 06 03:07:01 EDT 2007 | golff
Hi all, I am new on Xray technology. Can anyone give a idea about the void on the BGA? How are those happened and how can i detect it? Is it any article or link recommend? Thanks!!!
Electronics Forum | Wed Jun 06 11:19:21 EDT 2007 | ramseyn
Hello. What kind of void are you seeing? You said the part was a BGA, is it being underfilled or is it a solder void?
Electronics Forum | Wed Jun 27 09:05:18 EDT 2007 | jdumont
Agreed, try slowing the ramp rate down and possibly increasing bottom side temp to 170 if you have that ability. If youre using a hairdryer, youre screwed. Sometimes the 4 degrees C/sec is too fast especially with the FR-4 boardered BGAs.
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