Electronics Forum | Wed Feb 06 09:53:58 EST 2008 | slthomas
Something else I forgot to bring up....can we get by using our normal water soluble process or are we going to be able to clean under these things? The BGAs have .18mm and .30mm ball heights.
Electronics Forum | Wed Feb 06 15:11:49 EST 2008 | slthomas
Doug, do you know what the ball heights were on those BGAs? My understanding is that anything over .3mm is a cinch, but going down to .18 is dicey at best unless you have the best of all possible circumstances, which we don't.
Electronics Forum | Fri Feb 01 16:14:55 EST 2008 | bghusker
We bake components in reels quite often using a low temp oven. If you look under JDEC standards they provide temps and baking times based off of the thickness of the part. The only problem with the low temp is that you could be looking at baking ti
Electronics Forum | Wed Feb 06 17:28:27 EST 2008 | blnorman
We have some components on a reel that are 2.3 mm in thickness and need to be baked out. The reel has a warning not to exceed 50�C. According to J-STD-33, the proper bake out is 67 days @ 40�C.
Electronics Forum | Wed Feb 06 09:40:05 EST 2008 | phouwen
We are experiencing some difficulty in BGA assembly and would like to do some periodic on site dye and pry after different assembly processes. Does anyone do this now? Is it actually feasible? Does anyone have recomendations on equipment/dye suppl
Electronics Forum | Mon Feb 11 21:57:12 EST 2008 | davef
While you're waiting for others to reply, search the fine SMTnet Archives to find things like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=41292
Electronics Forum | Mon Feb 18 11:23:14 EST 2008 | operator
Have you contacted the manufacturer of the socket? They usually have some insight. I have heard of large BGA sockets being warped when they are received and flatten out during reflow. That is crazy to me, but there are people dealing with issues like
Electronics Forum | Mon Feb 25 11:12:32 EST 2008 | hegemon
It sounds more as though you have a profiling problem primarily, however, if your placement is not square to the board, then you should get your machine setup correct first. After that you can get to the profiling. If the BGA is brought up to tempe
Electronics Forum | Tue Mar 04 05:47:07 EST 2008 | andrzej
Can you describe what you mean by "pillow effect" Do you have any photos ?
Electronics Forum | Tue Mar 04 10:32:31 EST 2008 | tegel
Hi, Do you know if there is any standard that specify that a component manufacturer shall mark a BGA component in the corner where you have the ball A1? Best Regards, Lars
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