Electronics Forum: bga .4mm pitch (Page 1 of 83)

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro

It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Fri Aug 24 13:21:59 EDT 2018 | babe7362000

What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto

I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal

0.4mm pitch CSP Dummy Component

Electronics Forum | Tue Mar 05 22:35:49 EST 2002 | Nell

Hi Pete and Dave, I already check with Practical component, Tessera and TopLine Dummy component they said they only have up to 0.5mm pitch CSP. Anyway, thanks for your input... Do both of you know in the market right now is there any 0.4mm pitch C

BGA/Fine pitch footprints

Electronics Forum | Tue Mar 02 10:19:41 EST 2004 | loz

Hi all, we have recently seen a design that consists off a QFP100, pitch at 25". Also in the centre of this footprint is a FBGA165 footprint, pad size .4mm @ 1mm pitch. We have been informed that we will fit the QFP. I want to remove the BGA pads fr

mirco bga stencil opening

Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck

Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks

stencil thickness for bga

Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef

Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]

Fine pitch paste release problems.

Electronics Forum | Mon Dec 16 10:23:42 EST 2002 | Grant Petty

Hi, I have checked the archives, but need some advise. We have a 256 pin 1 mm pitch BGA part of our boards, and we have having problems with paste release our of the holes for the BGA. We just cannot seem to get it right, and we have to keep the st

feeder pitch

Electronics Forum | Mon Feb 14 13:25:52 EST 2005 | gregp

EIA-481 standard allows the maximum pitch on tape to be 4mm less than the tape width (12mm width and larger). So it is within the standard allowances. As for how common 20mm pitch on 24mm tape is I can not say. I am surprised a 24mm tape feeder ca

feeder pitch

Electronics Forum | Mon Feb 14 14:46:42 EST 2005 | russ

We use Samsung and our 24mm feeders have 8,12,16,and 20mm pitch settings. I have found 20mm pitch quite common. My favorite is yhe 12 on 12 our feeders don't support that, we have to put them up on 16mm feeders our cycle them 3 times on a 4mm pitch

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