Electronics Forum: bga 0.4mm pitch pcb (Page 2 of 18)

PCB thickness for .8 &1.0mm pitch bga's

Electronics Forum | Wed Jun 13 12:54:41 EDT 2001 | Dr. Harry

Does anyone have PCB thickness recomendations for .8 &1.0mm pitch bga's?

Reg. Reflow process for BGA pitch 6,5

Electronics Forum | Wed Oct 06 20:23:38 EDT 2021 | stephendo

If you can, it would be best to have a scrap board with a scrap BGA and drill a small hole in the bottom of the PCB and attach the thermocouple lead to a ball. This is assuming that you have a convection oven. If you have an IR oven, and that is wh

Solder Sphere/pad size plotted vs. pitch design?

Electronics Forum | Thu Dec 05 17:40:24 EST 2002 | davef

While unfamiliar with some of the terms you use, could this be what you seek? http://www.pcbstandards.com/downloads/Metric%20Environment/General%20Documentation/PCB%20Design/PCB%20Design%20Routing/Metric%20BGA%20Routing.pdf Stepping backwards just

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

Best way to fan-out 0.5mm pitch BGA for fastest prototyping

Electronics Forum | Wed Nov 23 19:50:23 EST 2016 | gmscribe

Hi guys, I'm working on a design involving a 223-pin BGA with 0.5mm pitch (ball size 0.3mm) with a 16-bit DDR3 controller involved. Currently routing a track between two balls is resulting in a track width of 0.1mm and a spacing of 0.077mm. Now the

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Mon Sep 08 01:45:35 EDT 2008 | rameshr

1.The Temperature on the pad is 247.C & also it is an lead free profile, the same profile we have used till last lot but we had obsereved this problem earlier to this current batch. 2. Both in Type3 & Type 4 paste we are using because of we are using

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon

Maybe something like this could work?

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold

We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef

That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl


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