Electronics Forum | Fri Nov 04 22:16:56 EST 2005 | mika
I forgot to mention something about the local fiducial marks: In the "old days" where board stretch was a factor to count with; the use of local fid's around a fine pitch component was sometimes necessary; not to forget that the pick & place machines
Electronics Forum | Thu May 03 01:07:18 EDT 2007 | pavel_murtishev
Good morning, Worth system for 0.5mm or more pitch paste printing. For less pitch (uBGA, 0.4mm etc) framed stencil are preferred due to better tensioning. Main issue with them is handling. Stencil apertures that are used for tensioning might be easi
Electronics Forum | Thu Jul 25 07:44:18 EDT 2002 | krs
Dennis thanks for the feedback. I can confirm we have also had 'black pad' type problems on gold pcbs fitted with BGAs. It can be as you say impossible to detect on Xray. We try to avoid gold pcbs for this reason, preferring horizontal HASL even whe
Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Fri Apr 19 07:50:24 EDT 2002 | pjc
I used to build flash memory products for M-Systems. Up to 30,000 per week. Nothing special in the process for these boards. 1mm and 0.4mm thick std. FR4 PCBs are used. Double-Sided reflow. The 0.4mm thin boards require process carriers. Panelized 24
Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg
I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some
Electronics Forum | Mon Feb 16 14:18:30 EST 2009 | jorge_quijano
1000 0402's, Micro BGA, QFP 0.4mm pitch, TSOP), we are trying to know what kind of equipment do you recommend to use in our factory, we already have Screen Printer, Chip shooters, Reflow oven, AOI, Stencil cleaner (manual), X ray, ICT... what else do
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Tue Sep 18 12:10:39 EDT 2007 | wailiang81
Hi, good day to all. This is my 1st question post in this forum. Hope able to share some knowledge here. As we know QFP area like 0.4mm pitch was a very critical area to control especially those PCB using silkscreen printing process manufactured. Onc
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