Electronics Forum | Fri Mar 03 06:41:09 EST 2000 | jacqueline coia
I have tried the IPC calculator and they do not have this type of component registered. When trying to select 'other' on menu, no connection can be made. The polarity if the QFP has not been decided yet (pre-PCB design) the pitch size of the componen
Electronics Forum | Fri Mar 03 06:41:09 EST 2000 | jacqueline coia
I have tried the IPC calculator and they do not have this type of component registered. When trying to select 'other' on menu, no connection can be made. The polarity if the QFP has not been decided yet (pre-PCB design) the pitch size of the componen
Electronics Forum | Wed Aug 27 11:09:55 EDT 2008 | fede
I�m interested in the F1 model, due to the possibility of this system to be configured with 1 top camera and 4 side. We are manufacturing 0402 and 0.4mm fine pitch Lead Free, and our PCB�s quality is not very good. With just one camera are you able t
Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika
Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t
Electronics Forum | Thu Jan 05 01:44:22 EST 2017 | soldertraining
In modern education, almost every Electronic Engineer must design a PCB. Once you get to know PCB design tools and functions, then creating a layout will become easier. Today, we find 0.4 mm pitch BGAs in every smartphone, and 0.3 mm ultra-fine pitch
Electronics Forum | Mon Oct 10 17:47:10 EDT 2005 | jhagve
hi We start to make a product which have a 0.4 mm pitch IC and start having problems with not enough solder printed, to solve this problem we had to increase the manual cleaning, now we are cleaning the stencil every 8 printings, before we was runnin
Electronics Forum | Tue Oct 11 10:49:14 EDT 2005 | jhagve
HI We start to make a product which have a 0.4 mm pitch IC and start having problems with not enough solder printed, to solve this problem we had to increase the manual cleaning, now we are cleaning the stencil every 8 printings, before we was runnin
Electronics Forum | Wed Dec 03 06:04:10 EST 2014 | spoiltforchoice
Manual placement aids are often very similar, I would suggest it is quite difficult to tell them all apart. Most of them include some kind of carousel for bins of loose parts and have the option of a few tape "feeders". If you are building small volu
Electronics Forum | Tue May 21 15:36:22 EDT 2019 | gregoireg
Thanks to @davef and @Evtimov for trying to help. It's useful but not exactly the answers I would like to get. I'm going to reformulate my question. I'm writing in mm so that it's more precise: I have a 0.12mm-thick stencil for some 0.4mm-pitch QFN
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
