Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Sun Jun 12 12:10:14 EDT 2005 | Sven
Hi all, I agree with all the postings above, but I have a few ammendmets: (How is my english so far?) The purpose of the so called "local fiducials" was in the old days, when "board stretch" was a factor. At least people think that was a big matter..
Electronics Forum | Mon Apr 29 14:36:26 EDT 2013 | bandjwet
I am trying to determine who out there is reballing devices below 0.4mm in pitch. We have been reballing as small as a 4-balled 0.15mm 4 mil ball diameter area array devices using an adhesive-backed reballing preform. 1. For such small devices we h
Electronics Forum | Wed Jul 30 00:47:10 EDT 2014 | matusov
Hello gurus, I am a hardware designer with a small company. We are about to send a new PCB for fabrication. This board uses dozens of tiny QFN, DFN, and similar packages. As a final check I have been going through the datasheets of all these parts t
Electronics Forum | Mon Aug 07 09:39:28 EDT 2006 | KHHO
Dear Sir, To design PCB with 0.8mm pitch BGAs, is ENIG PCB is better than Tlectro-plating PCB? Why? Than, what is the most effective way to determine the connection between BGA and PCB is good and strong enough?
Electronics Forum | Tue Sep 18 01:41:23 EDT 2001 | shvetangcd
Hi Jeff, We are having solder-short problems for BGA, QFP, and some other fine pitch parts while using DEK screen printers. The PCB is processed on the second half of the line for screening the side with BGA, QFP, and other fine pitch parts. Which m
Electronics Forum | Wed Aug 24 16:30:11 EDT 2016 | shawn_halo_1
I have a 1oz Flex PCB (FPC) that has 2 0.4mm pitch connectors that need to be SMTd and 9 4.5x1.0mm pads that have conductive rubber contacts that are press fitted onto the FPC. The FPC has a one time bend radius of 15.5mm. Image is attached that show
Electronics Forum | Fri Jun 03 10:04:51 EDT 2016 | sara_pcb
I am planning to attach 1760 pin BGA. The pitch is 1mm and Balls are SAC alloy type. The PCB is for aerospace use and expected to work in harsh environment. What is the recommended PCB surface finish and the attachment process for such a applicatio
Electronics Forum | Sun Nov 15 23:40:59 EST 1998 | emori
Our design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated.
Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko
Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have
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