Electronics Forum | Sat Apr 10 01:11:37 EDT 1999 | forest
Our company is going to use BGA(1.27mm pitch) But I have heard of troubles with P-BGA. It is that cracks occured between solderball and gold plating of PCB during ICT(incircuit test). We know that gold plating of PWB is not good for BGA, so we decide
Electronics Forum | Wed Aug 04 16:09:48 EDT 2004 | Dreamsniper
Hi, Thanks for your reply. I run 2 boards, using the same paste, thermal profile and the same method of aqueous cleaning, 1st is a Topline test board with topline BGA (BGA 272 with 1.27 Pitch) and the 2nd is our product PCB with our BGA from Motoro
Electronics Forum | Mon Aug 12 12:58:16 EDT 2002 | pjc
What I've done w/ eutectic ball BGA devices is after removing the BGA from the PCB, solder-suck the lands- get em nice a flat, apply a thin coat of gel flux to the solder lands and then a thin coat to only the bottom of the solder balls on the new BG
Electronics Forum | Wed Mar 14 13:16:54 EDT 2007 | Shane
I have a customer that designed a fine pitch BGA into a board, and has put small vias in the middle of each pad on the PCB. Anyone have any ideas on how I can prevent the solder from the BGA from flowing through the vias and causing voids or no cont
Electronics Forum | Mon Feb 11 17:21:40 EST 2008 | larryd
What causes BGA voids over 25%? Have recommended profile for solder paste, hit 237C for 5 seconds and still get a void on 2% of specific BGA in various locations. BGA is FG676, 1mm pitch, on ImAg using lead free paste OM338 on a 6 layer FR4 PCB.
Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris
Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes
Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F
Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F
Electronics Forum | Thu Jun 29 09:12:27 EDT 2000 | sree
What is the best aperture opening for micrBGA with 0.8 mm ball pitch and 16 mils ball diameter?The pad size on the PCB is 12 mils.
Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F
Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F
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