Electronics Forum | Fri Nov 09 10:25:43 EST 2001 | steven
is it all right to reflow a BGA using a rework station but without applying a layer of solder paste on pcb. the diameter of the solder ball is 0.75 and the pitch is 1.5mm.
Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Thu Jul 12 10:15:12 EDT 2007 | swag
I've got a proto build (3 boards) that has a Xilinx FG456 fine-pitch BGA on it. Every BGA pad on the PCB has an unmasked via attached. Between the via and the pad is a thin soldermask strip, maybe .005" wide at best. I am very confident it will br
Electronics Forum | Sat Dec 22 01:34:26 EST 2018 | sara_pcb
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product. 1. Is there any long term reliability issues with 2% Ag in BGA Ball. 2. If the PCB finish
Electronics Forum | Fri May 30 18:57:44 EDT 2003 | russ
We place a large amount of .4mm (what is that in microns?)QFPs every day. I would much prefer a BGA package. Reasons are 1. Pitch is greater which provides a larger process window 2. Alignment is easier because you don't need vision for BGA if you
Electronics Forum | Wed Jul 03 10:37:41 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Thu Jun 09 07:02:02 EDT 2005 | ajaydoshi
1. We do have PCB with 0402 component, Micro BGA ( 0.5mm pitch , 0.25 mm pad size ). PCB thickness is 0.8mm. What stencil thickness we should use. PCB size 40 mm X 60 mm 2. We have EKRA E4 , What will be optimum setting for above. Pressure, Scquge s
Electronics Forum | Tue Aug 30 22:38:54 EDT 2005 | cabs
Does any one knows where to get a plating thickness meter that can be use in the fine pitch contacts and trace in PCB application like BGA pads? If there's a hand held device at lower cost much better... Also if you can recommend companies that offer
Electronics Forum | Wed Mar 14 10:02:36 EST 2001 | blair
Boards were not immersion gold. They were HASL but I would like to change. What is the prefered surface fininsh for BGA and fine pitch stuff these days? I am starting to ask for Gold/Nickel on FAB Dwgs due to PCB house and assy house discussions.
Electronics Forum | Mon Jul 28 16:32:45 EDT 2003 | itempea
Mant, we are reliably replacing BGAs of all sizes and pitches on ENIG. The black pad is not something created through rework, but a defect that the PCB has from the very beginning. Ioan
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